Memory IC GD25D80ETIGR product image

GD25D80ETIGR

$0.22
  • Description:IC FLASH 8MBIT SPI/DUAL 8SOP
  • Series:GD25D
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR)

SKU:ad4373d638e7 Category: Brand:

  
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GD25D80ETIGR is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 8MBIT SPI/DUAL 8SOP. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GD25D80ETIGR

  • Description:IC FLASH 8MBIT SPI/DUAL 8SOP
  • Series:GD25D
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR)
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NOR (SLC)
  • Memory Size:8Mbit
  • Memory Organization:1M x 8
  • Memory Interface:SPI - Dual I/O
  • Clock Frequency:104 MHz
  • Write Cycle Time - Word, Page:50µs, 4ms
  • Voltage - Supply:2.7V ~ 3.6V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:8-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package:8-SOP
  • Access Time:6 ns
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for GD25D80ETIGR

GD25D80ETIGR

Memory IC Overview

The GD25D80ETIGR is an 8 Mbit (1M x 8) SPI NOR flash memory IC manufactured by GigaDevice. It operates within a supply voltage range of 2.7 V to 3.6 V and supports Dual I/O SPI interfaces with a maximum clock frequency of 104 MHz. The device features a write cycle time of 6 ns for access, with word and page write times specified at 50 µs and 4 ms respectively. It is housed in an 8-USON (1.5x1.5 mm) package with exposed pads, suitable for surface mount installation. The component functions reliably across an industrial temperature range from -40°C to +85°C.

Memory IC Feature Summary

  • Supports standard and dual I/O SPI interface protocols for flexible data transfer modes.
  • Utilizes SLC NAND technology for non-volatile code storage applications.
  • Features a compact 8-USON package design optimized for space-constrained surface mount layouts.

Memory IC Applications

  • Embedded systems requiring reliable code execution from flash memory
  • Consumer electronics devices utilizing small form factor components
  • Industrial control systems operating within extended temperature ranges

Memory IC Procurement Notes

Verify the specific suffix 'K' against official datasheets to confirm package dimensions and pinout compatibility. Ensure the target system provides a stable 2.7V to 3.6V power rail. Confirm that the design accommodates the exposed pad thermal requirements of the 8-USON package. Cross-reference the manufacturer's latest documentation for any updates regarding moisture sensitivity levels or RoHS compliance status before finalizing procurement.

Memory IC Selection Notes

Select this component when a balance between moderate speed and low cost is required for 8 Mbit storage. The Dual I/O support offers improved throughput over standard SPI without the complexity of Quad interfaces found in higher-end models. Consider the 8-USON footprint if board real estate is limited compared to SOP packages. Validate that the 104 MHz clock speed meets the timing constraints of the host microcontroller interface.

Memory IC Part Context

This part belongs to the GD25D series of SPI NOR flash memories from GigaDevice. The series targets general-purpose embedded applications needing dependable non-volatile storage. The 'D' designation typically indicates specific performance characteristics distinguishing it from LD or Q variants. This family emphasizes reliability and standard interface compatibility for widespread integration across various electronic product categories.

Memory IC Replacement Considerations

GD25D80EKIGR is listed as a parameter equivalent alternative offering identical electrical specifications and functionality.

GD25D80ETIGRGD25D80ETIGR
$0.22
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