Memory IC GD25F128FWIGR product image

GD25F128FWIGR

$1.14
  • Description:IC FLASH 128MBIT SPI/QUAD 8WSON
  • Series:GD25F
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR)

SKU:f2e6280cccae Category: Brand:

  
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GD25F128FWIGR is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 128MBIT SPI/QUAD 8WSON. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GD25F128FWIGR

  • Description:IC FLASH 128MBIT SPI/QUAD 8WSON
  • Series:GD25F
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR)
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NOR (SLC)
  • Memory Size:128Mbit
  • Memory Organization:16M x 8
  • Memory Interface:SPI - Quad I/O
  • Clock Frequency:200 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:2.7V ~ 3.6V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:8-WDFN Exposed Pad
  • Supplier Device Package:8-WSON (5x6)
  • Access Time:-
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for GD25F128FWIGR

GD25F128FWIGR

Memory IC Overview

The GD25F128FWIGR is a 128 Mbit NOR flash memory device manufactured by GigaDevice. It utilizes an SPI interface with a maximum clock frequency of 133 MHz. The component operates within a supply voltage range of 2.7 V to 3.6 V and supports surface mount installation in a WSON-8 package. It functions reliably across a temperature range from -40°C to +85°C.

Memory IC Feature Summary

  • Provides non-volatile code storage via SPI interface
  • Supports standard and dual I/O data transfer modes
  • Designed for compact surface-mount applications

Memory IC Applications

  • Consumer electronics firmware storage
  • Industrial control system code execution
  • Embedded application data retention

Memory IC Procurement Notes

Verify the specific suffix against official manufacturer documentation to confirm pinout, voltage tolerance, and package dimensions. Ensure compatibility with existing board layouts before integration. Confirm availability through authorized distributors as stock levels fluctuate. Validate that the operating environment matches the specified temperature and voltage ranges.

Memory IC Selection Notes

Select this component when a 128 Mbit capacity is required for code storage in space-constrained designs. The WSON-8 package offers a small footprint suitable for portable devices. Verify that the host controller supports the necessary SPI protocol speeds. Consider thermal management requirements given the operational temperature limits.

Memory IC Part Context

This part belongs to the GD25F series of SPI NOR flash memories from GigaDevice. The series targets general-purpose embedded applications requiring reliable non-volatile storage. The family includes various densities and package options to accommodate different design constraints and performance needs.

Memory IC Replacement Considerations

Check for exact pin-compatible alternatives within the same density class. Verify if higher-speed variants like the GD25F256FWIGR offer backward compatibility. Ensure any substitute maintains the same voltage and temperature specifications.

GD25F128FWIGRGD25F128FWIGR
$1.14
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