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GD25F128FYAGY is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 128MBIT SPI/QUAD 8WSON. Review the specifications below when checking this part for your BOM.
Memory IC specifications for GD25F128FYAGY
- Description：IC FLASH 128MBIT SPI/QUAD 8WSON
- Series：GD25F
- Mfr：GigaDevice Semiconductor (HK) Limited
- Package：Tray
- Memory Type：Non-Volatile
- Memory Format：FLASH
- Technology：FLASH - NOR (SLC)
- Memory Size：128Mbit
- Memory Organization：16M x 8
- Memory Interface：SPI - Quad I/O
- Clock Frequency：200 MHz
- Write Cycle Time - Word, Page：-
- Voltage - Supply：2.7V ~ 3.6V
- Operating Temperature：-40°C ~ 125°C (TA)
- Mounting Type：Surface Mount
- Package / Case：8-WDFN Exposed Pad
- Supplier Device Package：8-WSON (6x8)
- Access Time：-
- Grade：-
- Qualification：-
Memory IC datasheet and documents for GD25F128FYAGY
Memory IC Overview
The GD25F128FYAGY is a 128 Mbit SPI NOR Flash memory IC manufactured by GigaDevice. It utilizes an 8-WSON (6x8) surface-mount package and supports Quad I/O SPI interfaces with a maximum clock frequency of 200 MHz. The device operates within a supply voltage range of 2.7 V to 3.6 V and functions reliably across a temperature range of -40°C to +125°C.
Memory IC Feature Summary
- Supports high-speed Quad I/O SPI interface for efficient data transfer
- Operates within extended industrial temperature ranges for robust performance
- Utilizes compact 8-WSON packaging suitable for space-constrained designs
Memory IC Applications
- Embedded systems requiring non-volatile code storage
- Industrial control equipment operating in harsh environments
- Consumer electronics utilizing surface-mount technology
Memory IC Procurement Notes
Verify the specific suffix 'FYAGY' against official manufacturer documentation to confirm pinout compatibility and electrical characteristics. Ensure that the 8-WSON package dimensions align with your PCB footprint requirements. Confirm that the 2.7V to 3.6V supply voltage matches your system design constraints before finalizing procurement.
Memory IC Selection Notes
Select this component when a balance of high-speed Quad SPI performance and extended temperature operation is required in a small form factor. The 128 Mbit density suits applications needing moderate code storage capacity. Consider the 8-WSON package size relative to available board space and thermal management capabilities during the design phase.
Memory IC Part Context
This part belongs to the GD25F series of SPI NOR Flash memories from GigaDevice, which are widely used for storing firmware and boot code. The series offers various densities and packages, with the FYAGY variant specifically providing Quad I/O support and industrial-grade temperature ratings in a compact WSON housing.
Memory IC Replacement Considerations
Check for direct substitutes within the GD25F family with identical pinouts and specifications. Verify compatibility with existing firmware if replacing in production. Ensure any alternative maintains the same 8-WSON package and voltage/temperature ratings.
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