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GD25F256FW2GY is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 256MBIT SPI/QUAD 8WSON. Review the specifications below when checking this part for your BOM.
The GD25F256FW2GY is a 256 Mbit SPI NOR Flash memory device manufactured by GigaDevice. It operates within a supply voltage range of 2.7 V to 3.6 V and supports Single, Dual, Quad, and DTR I/O bus interfaces. The component achieves clock frequencies up to 200 MHz in standard modes and 104 MHz in DTR mode. It utilizes an 8-WSON package with dimensions of 5x6 mm and functions across an industrial temperature range of -40°C to 105°C.
Verify the specific package dimension suffix 'W' corresponds to the required 5x6 mm footprint against schematic constraints. Confirm that the operating voltage range of 2.7V to 3.6V aligns with the target system power rails. Ensure the industrial temperature grade (-40°C to 105°C) meets environmental specifications. Check current availability status as supply may be restricted due to market conditions.
Select this component when a 256 Mbit density is required with support for high-speed Quad and DTR SPI interfaces. It is suitable for designs needing hardware ECC and OTP security features without external logic. Compare against the FY2GR variant if a 6x8 mm package is preferred instead of the 5x6 mm form factor. Ensure the controller supports the necessary I/O modes for optimal performance.
This part belongs to the GD25F series of SPI NOR Flash memories from GigaDevice. The series covers densities from 512Kb to 2Gb and supports various voltage levels including 3V and 1.8V variants. The GD25F family is designed for general-purpose non-volatile storage with a focus on reliability and small package options for embedded applications.
GD25F256FY2GR offers identical electrical specifications but uses an 8-WSON(6x8) package instead of the 5x6 mm footprint. Verify mechanical compatibility before substitution.
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