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GD25F256FWIGR is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 256MBIT SPI/QUAD 8WSON. Review the specifications below when checking this part for your BOM.
Memory IC specifications for GD25F256FWIGR
- Description：IC FLASH 256MBIT SPI/QUAD 8WSON
- Series：GD25F
- Mfr：GigaDevice Semiconductor (HK) Limited
- Package：Tape & Reel (TR)
- Memory Type：Non-Volatile
- Memory Format：FLASH
- Technology：FLASH - NOR (SLC)
- Memory Size：256Mbit
- Memory Organization：32M x 8
- Memory Interface：SPI - Quad I/O
- Clock Frequency：200 MHz
- Write Cycle Time - Word, Page：-
- Voltage - Supply：2.7V ~ 3.6V
- Operating Temperature：-40°C ~ 85°C (TA)
- Mounting Type：Surface Mount
- Package / Case：8-WDFN Exposed Pad
- Supplier Device Package：8-WSON (5x6)
- Access Time：-
- Grade：-
- Qualification：-
Memory IC datasheet and documents for GD25F256FWIGR
Memory IC Overview
The GD25F256FWIGR is a 256 Mbit NOR flash memory device manufactured by GigaDevice. It features an SPI interface with a maximum clock frequency of 166 MHz and operates within a voltage range of 2.7 V to 3.6 V. The memory organization is 32 M x 8 bits, housed in a WSON-8 package suitable for SMD/SMT installation. It supports an industrial temperature range from -40°C to +85°C.
Memory IC Feature Summary
- Supports high-speed serial peripheral interface communication up to 166 MHz
- Provides non-volatile data storage with 256 Mbit capacity
- Operates reliably across extended industrial temperature ranges
Memory IC Applications
- Consumer electronics firmware storage
- Industrial control system code execution
- Network communication equipment configuration
Memory IC Procurement Notes
Verify the specific suffix 'WIGR' against the official datasheet to confirm the exact package dimensions and tape-and-reel specifications. Ensure the ordering quantity aligns with the manufacturer's standard packaging requirements. Confirm that the intended application environment remains within the specified electrical and thermal limits defined in the product documentation.
Memory IC Selection Notes
Select this component when a 256 Mbit density is required with a compact WSON-8 footprint. It is suitable for designs needing SPI compatibility and operation between 2.7 V and 3.6 V. Consider the 166 MHz speed for applications requiring faster read access compared to lower-frequency alternatives in the same series.
Memory IC Part Context
This part belongs to the GD25F series of SPI NOR flash memories from GigaDevice. The series offers various densities and packages to support diverse embedded storage needs. The GD25F256FWIGR specifically targets applications requiring a balance of performance, reliability, and small form factor within the industrial temperature grade.
Memory IC Replacement Considerations
Check for pin-compatible alternatives within the GD25F series that may offer different package options or updated manufacturing statuses. Verify if newer revisions of the same part number are available to ensure long-term supply availability.
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