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GD25F256FY2GR is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 256MBIT SPI/QUAD 8WSON. Review the specifications below when checking this part for your BOM.
The GD25F256FY2GR is a 256Mb SPI NOR Flash memory IC manufactured by GigaDevice. It utilizes Single-Level Cell (SLC) technology and supports Quad I/O SPI interfaces with a clock frequency of 200 MHz. The device offers a storage organization of 32M x 8 bits and operates within a supply voltage range of 2.7V to 3.6V. It is housed in an 8-WSON package measuring 6x8 mm, designed for surface mount installation. The component supports industrial operating temperatures ranging from -40°C to 105°C.
Verify the specific suffix 'Y2' against the manufacturer's official datasheet to confirm pinout compatibility and electrical characteristics. Ensure the selected package variant matches the PCB footprint requirements. Confirm that the 200 MHz clock speed aligns with the target system's bus capabilities. Validate temperature ratings against the operational environment constraints before finalizing procurement.
Select this component when a 256Mb density is required with high-speed Quad SPI access. The 8-WSON package suits space-constrained designs needing robust industrial temperature performance. Consider the 2.7V-3.6V supply range for compatibility with standard logic levels. Evaluate the need for hardware reset and security features inherent to the GD25F series architecture.
This part belongs to the GD25F series of SPI NOR Flash memories from GigaDevice. The series is engineered for diverse design requirements across automotive, industrial, and consumer sectors. It emphasizes high performance, security, and long-term availability. The GD25F256FY2GR specifically targets applications demanding reliable non-volatile storage with fast read speeds.
Cross-reference with other GD25F256 variants such as GD25F256FW2GR or GD25F256FFARR for package differences. Verify if alternative packages like SOP-16 or TFBGA meet mechanical constraints. Ensure functional equivalence regarding interface speed and voltage specifications before substitution.
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