GD25F256FYAGR

Memory IC Overview

The GD25F256FYAGR is a 256 Mbit SPI NOR flash memory component manufactured by GigaDevice. It features a storage organization of 32M x 8 and supports dual and quad I/O interfaces with a maximum clock frequency of 166 MHz. The device operates within a supply voltage range of 2.7 V to 3.6 V and is housed in an 8-WSON package. It is designed for industrial temperature ranges, functioning reliably between -40°C and +85°C.

Memory IC Feature Summary

• Supports standard SPI, dual I/O, and quad I/O interface modes for flexible data transfer.
• Includes hardware reset functionality to ensure system stability during operation.
• Integrates security registers with OTP locks for data protection.
• Features error correction code (ECC) capabilities to enhance data integrity.

Memory IC Applications

• Industrial control systems requiring reliable non-volatile storage
• Internet of Things (IoT) devices with space-constrained designs
• Consumer electronics utilizing firmware storage
• Automotive embedded applications

Memory IC Procurement Notes

Verify the specific suffix 'YAGR' against official manufacturer documentation to confirm package dimensions and tape-and-reel specifications. Ensure compatibility with existing board layouts regarding the 8-WSON footprint. Confirm that the selected variant meets the required industrial temperature range and voltage specifications for the target application environment before finalizing procurement.

Memory IC Selection Notes

Select this component when a 256 Mbit capacity is required with support for high-speed quad I/O operations. Consider the 8-WSON package size for compact PCB designs. Verify that the operating voltage range aligns with the system power supply. Evaluate the need for hardware reset and security features inherent to the GD25F series architecture.

Memory IC Part Context

This part belongs to the GD25F family of SPI NOR flash memories from GigaDevice. The family is characterized by high performance and integrated security features. Variants within the series differ primarily in packaging options, such as SOP-16 or WSON-8, and temperature grades. The GD25F256FYAGR specifically utilizes the WSON-8 form factor suitable for surface mount assembly.

Memory IC Replacement Considerations

Cross-reference with other GD25F256 variants sharing the same density and interface but differing in package or temperature grade. Verify pinout compatibility if substituting with different suffixes. Consult the manufacturer's selection guide for equivalent parts with identical electrical characteristics.