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GD25F64FB2RY is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH. Review the specifications below when checking this part for your BOM.
Memory IC specifications for GD25F64FB2RY
- Description：IC FLASH
- Series：-
- Mfr：GigaDevice Semiconductor (HK) Limited
- Package：Tray
- Memory Type：-
- Memory Format：FLASH
- Technology：FLASH - NOR
- Memory Size：-
- Memory Organization：-
- Memory Interface：-
- Clock Frequency：-
- Write Cycle Time - Word, Page：-
- Voltage - Supply：-
- Operating Temperature：-
- Mounting Type：-
- Package / Case：-
- Supplier Device Package：-
- Access Time：-
- Grade：-
- Qualification：-
Memory IC datasheet and documents for GD25F64FB2RY
Memory IC Overview
The GD25F64FB2RY is a 64Mb SPI NOR Flash memory device manufactured by GigaDevice. It operates within a voltage range of 2.7V to 3.6V and supports Single, Dual, Quad I/O, and DTR bus modes with frequencies up to 166MHz for x1/x2/x4 modes and 104MHz for x4 DTR mode. The component features ECC, hardware reset, security registers with OTP locks, and suspend capabilities. It is available in SOP8, SOP16, USON8, WSON8, and TFBGA24 packages, with industrial temperature ranges spanning from -40°C to 85°C or higher.
Memory IC Feature Summary
- Supports multiple I/O bus modes including Single, Dual, Quad, and Double Data Rate (DTR) for flexible interface compatibility.
- Includes hardware reset functionality and security registers with One-Time Programmable (OTP) lock capabilities.
- Integrates Error Correction Code (ECC) and suspend/resume operations for enhanced data integrity and system efficiency.
Memory IC Applications
- Consumer electronics firmware storage
- Industrial control systems code execution
- Automotive embedded applications requiring functional safety
Memory IC Procurement Notes
Verify the specific package suffix B2RY corresponds to the required 24-TFBGA(6x8) form factor. Confirm the operating temperature grade matches the design requirement, as the series supports -40°C to 85°C, 105°C, and 125°C variants. Ensure the voltage supply aligns with the 2.7V-3.6V specification. Cross-reference the latest datasheet for any updates on pinout or electrical characteristics before finalizing the bill of materials.
Memory IC Selection Notes
Select this part when a 64Mb density is required with support for high-speed Quad I/O and DTR interfaces. It is suitable for designs needing hardware reset and security features. Compare against other densities in the GD25F series if larger storage is needed. Consider the TFBGA24 package for compact layouts. Verify automotive qualification if the application demands AEC-Q100 compliance and ISO 26262 certification.
Memory IC Part Context
This component belongs to the GD25/55 SPI NOR Flash family, which covers densities from 512Kb to 2Gb. The series targets diverse markets including consumer electronics and automotive systems. GigaDevice offers various power supply options and package sizes within this family to meet different performance and reliability requirements.
Memory IC Replacement Considerations
Check for direct substitutes within the GD25F series with compatible pinouts and electrical parameters. Verify that alternative parts support the same DTR frequency and package type. Ensure any replacement maintains the required security and ECC features.
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