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GD25F64FBARY is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH. Review the specifications below when checking this part for your BOM.
Memory IC specifications for GD25F64FBARY
- Description：IC FLASH
- Series：-
- Mfr：GigaDevice Semiconductor (HK) Limited
- Package：Tray
- Memory Type：-
- Memory Format：FLASH
- Technology：FLASH - NOR
- Memory Size：-
- Memory Organization：-
- Memory Interface：-
- Clock Frequency：-
- Write Cycle Time - Word, Page：-
- Voltage - Supply：-
- Operating Temperature：-
- Mounting Type：-
- Package / Case：-
- Supplier Device Package：-
- Access Time：-
- Grade：-
- Qualification：-
Memory IC datasheet and documents for GD25F64FBARY
Memory IC Overview
The GD25F64FBARY is a 64 Mbit SPI NOR Flash memory device manufactured by GigaDevice. It operates within a supply voltage range of 2.7 V to 3.6 V and supports Single, Dual, and Quad SPI interfaces with a maximum clock frequency of 166 MHz. The component utilizes synchronous timing and is designed for surface-mount installation in SOP8, WSON8, or TFBGA24 packages.
Memory IC Feature Summary
- Supports Single, Dual, and Quad I/O bus modes for flexible interface compatibility
- Integrates hardware-based Error Correction Code (ECC) algorithms
- Includes security registers with One-Time Programmable (OTP) lock capabilities
- Features hardware reset functionality and unique identification
Memory IC Applications
- Consumer electronics firmware storage
- Industrial control system code execution
- Internet of Things (IoT) device programming
- Network communication equipment booting
Memory IC Procurement Notes
Verify the specific package variant and temperature grade against project requirements, as the GD25F64F series offers multiple options including SOP8, WSON8, and TFBGA24. Confirm industrial temperature ranges (-40°C to +85°C, -40°C to +105°C, or -40°C to +125°C) match environmental specifications. Ensure the selected part number suffix aligns with the required density and interface configuration before finalizing procurement orders.
Memory IC Selection Notes
Select this component when a 64 Mbit capacity is required with support for high-speed Quad SPI operations up to 166 MHz. It is suitable for designs needing robust data integrity features such as hardware ECC and OTP security locks. Consider the available package types, including SOP8 and WSON8, to fit board space constraints while maintaining SMD/SMT mounting compatibility.
Memory IC Part Context
This device belongs to the GigaDevice GD25/55 SPI NOR Flash family, which provides densities ranging from 512Kb to 2Gb. The series targets diverse market segments with a focus on high performance, low power consumption, and reliability. These products are widely used in embedded applications requiring scalable and dependable non-volatile code storage solutions across consumer and industrial domains.
Memory IC Replacement Considerations
Direct substitutes within the same density and feature set include other GD25F64F variants with different package suffixes or temperature grades. Verify pinout compatibility and electrical characteristics before swapping components.
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