Memory IC GD25LB128EFIRR product image

GD25LB128EFIRR

$1.23
  • Description:IC FLASH 128MBIT SPI/QUAD 16SOP
  • Series:GD25LB
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR)

SKU:8f3af571b3c2 Category: Brand:

  
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GD25LB128EFIRR is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 128MBIT SPI/QUAD 16SOP. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GD25LB128EFIRR

  • Description:IC FLASH 128MBIT SPI/QUAD 16SOP
  • Series:GD25LB
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR)
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NOR (SLC)
  • Memory Size:128Mbit
  • Memory Organization:16M x 8
  • Memory Interface:SPI - Quad I/O, QPI, DTR
  • Clock Frequency:133 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:1.65V ~ 2V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:16-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package:16-SOP
  • Access Time:-
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for GD25LB128EFIRR

GD25LB128EFIRR

Memory IC Overview

The GD25LB128EFIRR is a 128M-bit (16M-byte) SPI NOR flash memory manufactured by GigaDevice. It operates on a single power supply voltage ranging from 1.65V to 2.0V. The device supports Standard, Dual, and Quad SPI interfaces, as well as QPI mode, with a maximum clock frequency of 133MHz. It features uniform sector architecture with 4K-byte sectors and 32/64K-byte blocks. The component is housed in a 16-lead SOP package and functions within an operating temperature range of -40°C to +85°C.

Memory IC Feature Summary

  • Supports standard, dual, quad SPI, and QPI modes for flexible data transfer rates up to 532Mbits/s.
  • Includes advanced security features such as 128-bit unique ID, software write protection, and three sets of security registers with OTP locks.
  • Offers high endurance with minimum 100,000 program/erase cycles and typical 20-year data retention.
  • Enables Execute In Place (XiP) operation with continuous read wrap capabilities to reduce SoC cache fill latency.

Memory IC Applications

  • Code storage for embedded systems requiring low voltage operation
  • Firmware storage for IoT devices and wearables
  • Data logging applications needing high reliability
  • Consumer electronics with strict power constraints

Memory IC Procurement Notes

Verify the specific ordering suffix against the manufacturer's official datasheet to confirm package type and voltage range compatibility. Ensure the design supports the 1.65V to 2.0V supply requirement. Confirm that the 16-SOP package dimensions meet PCB layout specifications. Check for any special order requirements regarding status register protection bits if hardware lock-down is needed.

Memory IC Selection Notes

Select this component when a low-voltage (1.65V-2.0V) SPI NOR flash is required for code execution or data storage. It is suitable for designs prioritizing power efficiency over wide voltage tolerance. Consider the 16-SOP package size relative to available board space. Ensure the host controller supports the necessary SPI modes and command sets for optimal performance.

Memory IC Part Context

This part belongs to the GD25LB series, which focuses on ultra-low power consumption for battery-powered applications. Unlike the GD25Q series which supports wider voltage ranges, the LB series is optimized for 1.65V to 2.0V operation. It shares the same 128M-bit density and interface capabilities as other members in the GD25L family but differs in voltage specifications and packaging options.

Memory IC Replacement Considerations

GD25LB128ESIGR: Same capacity and voltage range but in SOP-8 package. GD25LB128EYIGR: Same capacity and voltage range but in WSON-8 package. Verify pinout compatibility and thermal requirements when substituting between different package types.

GD25LB128EFIRRGD25LB128EFIRR
$1.23
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