Memory IC GD25LB256EBJRY product image

GD25LB256EBJRY

$2.24
  • Description:IC FLASH 256MBIT SPI/QUAD
  • Series:GD25LB
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tray

SKU:a0865b8b454a Category: Brand:

  
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GD25LB256EBJRY is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 256MBIT SPI/QUAD. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GD25LB256EBJRY

  • Description:IC FLASH 256MBIT SPI/QUAD
  • Series:GD25LB
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tray
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NOR (SLC)
  • Memory Size:256Mbit
  • Memory Organization:32M x 8
  • Memory Interface:SPI - Quad I/O, QPI, DTR
  • Clock Frequency:166 MHz
  • Write Cycle Time - Word, Page:140µs, 2ms
  • Voltage - Supply:1.65V ~ 2V
  • Operating Temperature:-40°C ~ 105°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:24-TBGA
  • Supplier Device Package:24-TFBGA (6x8)
  • Access Time:5 ns
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for GD25LB256EBJRY

GD25LB256EBJRY

Memory IC Overview

The GD25LB256EBJRY is a 256 Mbit NOR flash memory device manufactured by GigaDevice. It features a 32 M x 8 organization and operates within a supply voltage range of 1.65 V to 2 V. The component supports DTR/Quad SPI, QPI, and SPI interfaces with a maximum clock frequency of 166 MHz. It utilizes a TFBGA-24 package for surface mount installation. The active read current is specified at a maximum of 28 mA. The device is designed for industrial temperature ranges, functioning between -40°C and +105°C.

Memory IC Feature Summary

  • Supports high-speed DTR/Quad SPI, QPI, and standard SPI communication protocols
  • Provides synchronous timing operation for efficient data transfer
  • Engineered for low power consumption with defined active read current limits
  • Built for reliability in industrial environments across extended temperature ranges

Memory IC Applications

  • Industrial control systems requiring robust code storage
  • Automotive electronics demanding wide temperature tolerance
  • Consumer devices utilizing surface mount technology constraints
  • Embedded systems needing non-volatile data retention

Memory IC Procurement Notes

Verify the specific suffix JRY against official GigaDevice documentation to confirm package dimensions and tape-and-reel specifications. Ensure compatibility with existing PCB footprints for the TFBGA-24 configuration. Confirm that the 1.65V to 2V voltage range aligns with the target system's power delivery network. Check for RoHS compliance status through authorized distributors before finalizing procurement plans.

Memory IC Selection Notes

Select this component when a 256 Mbit density is required alongside support for advanced DTR or Quad SPI modes. The TFBGA-24 package is suitable for applications prioritizing compact board space. Consider the -40°C to +105°C operating range for industrial durability. Verify that the 166 MHz clock speed meets the bandwidth requirements of the host processor interface.

Memory IC Part Context

This part belongs to the GD25LB series of SPI NOR flash memories from GigaDevice. The series targets applications requiring high performance and low power consumption. It complements other densities in the portfolio, offering a balance of capacity and interface flexibility. The device is positioned for use in modern embedded designs where reliable non-volatile storage is critical.

Memory IC Replacement Considerations

Check for GD25LB256EWIGR or GD25LB256EFIRR if different packaging such as WSON-8 or SOP-16 is needed. Verify pinout compatibility and electrical characteristics before substituting. Ensure the replacement part supports the same voltage and temperature specifications.

GD25LB256EBJRYGD25LB256EBJRY
$2.24
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