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GD25LB256FWIGR is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 256MBIT SPI/QUAD. Review the specifications below when checking this part for your BOM.
Memory IC specifications for GD25LB256FWIGR
- Description：IC FLASH 256MBIT SPI/QUAD
- Series：GD25LB
- Mfr：GigaDevice Semiconductor (HK) Limited
- Package：Tape & Reel (TR)
- Memory Type：Non-Volatile
- Memory Format：FLASH
- Technology：FLASH - NOR (SLC)
- Memory Size：256Mbit
- Memory Organization：32M x 8
- Memory Interface：SPI - Quad I/O, QPI
- Clock Frequency：133 MHz
- Write Cycle Time - Word, Page：110µs, 1.2ms
- Voltage - Supply：1.65V ~ 2V
- Operating Temperature：-40°C ~ 85°C (TA)
- Mounting Type：Surface Mount
- Package / Case：8-WDFN Exposed Pad
- Supplier Device Package：8-WSON (5x6)
- Access Time：6 ns
- Grade：-
- Qualification：-
Memory IC datasheet and documents for GD25LB256FWIGR
Memory IC Overview
The GD25LB256FWIGR is a 256 Mbit SPI NOR Flash memory device manufactured by GigaDevice. It features a storage organization of 32 M x 8 bits and supports an interface with a maximum clock frequency of 133 MHz. The component operates within a supply voltage range of 1.65 V to 2 V. It is housed in a WSON-8 package (6x5mm) and is designed for surface mount installation. The device functions reliably across an industrial temperature range from -40°C to +85°C.
Memory IC Feature Summary
- Supports Dual/Quad SPI, QPI, and standard SPI interfaces for flexible data transfer modes.
- Includes hardware reset functionality and security registers with OTP locks for data protection.
- Features ECC support and unique ID capabilities integrated into the architecture.
Memory IC Applications
- Embedded systems requiring reliable code storage
- Consumer electronics devices
- Industrial control applications
Memory IC Procurement Notes
Verify the specific suffix 'FWIGR' against the official datasheet to confirm package dimensions and tape-and-reel specifications. Ensure the design accommodates the 1.65 V to 2 V operating voltage range. Confirm that the target application environment remains within the specified -40°C to +85°C temperature limits for optimal performance and longevity.
Memory IC Selection Notes
Select this component when a low-voltage 256 Mbit NOR Flash solution is required. It is suitable for designs prioritizing small form factors due to the WSON-8 packaging. Consider its 133 MHz speed capability for applications needing moderate read performance. Verify compatibility with the system's I/O voltage levels before integration.
Memory IC Part Context
This part belongs to the GD25L series of SPI NOR Flash memories from GigaDevice. The series targets mobile and consumer markets with a focus on low power consumption and high reliability. These products are engineered to provide scalable storage solutions for embedded applications requiring efficient code execution and data retention.
Memory IC Replacement Considerations
Public confirmed substitute part numbers are not available in the provided documentation. Consult the manufacturer's cross-reference guide or datasheet for verified alternatives.
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