Memory IC GD25LB32ESIGR product image

GD25LB32ESIGR

$0.57
  • Description:IC FLASH 32MBIT SPI/QUAD 8SOP
  • Series:GD25LB
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR)

SKU:bceacbb45e23 Category: Brand:

  
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GD25LB32ESIGR is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 32MBIT SPI/QUAD 8SOP. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GD25LB32ESIGR

  • Description:IC FLASH 32MBIT SPI/QUAD 8SOP
  • Series:GD25LB
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR)
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NOR (SLC)
  • Memory Size:32Mbit
  • Memory Organization:4M x 8
  • Memory Interface:SPI - Quad I/O, QPI
  • Clock Frequency:133 MHz
  • Write Cycle Time - Word, Page:60µs, 2.4ms
  • Voltage - Supply:1.65V ~ 2V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:8-SOIC (0.209", 5.30mm Width)
  • Supplier Device Package:8-SOP
  • Access Time:6 ns
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for GD25LB32ESIGR

GD25LB32ESIGR

Memory IC Overview

The GD25LB32ESIGR is a 32 Mbit (4M x 8) SPI NOR Flash memory manufactured by GigaDevice. It operates on a single power supply voltage ranging from 1.65 V to 2.0 V and supports standard, Dual, Quad SPI, and QPI interfaces with a maximum clock frequency of 133 MHz. The device features uniform sector architecture with 4 KByte sectors and 32/64 KByte blocks. It includes advanced security features such as 128-bit unique IDs, software write protection, and three 1024-Byte security registers with OTP locks. The component is housed in an SOP-8 package and supports XIP operations.

Memory IC Feature Summary

  • Supports standard, Dual, Quad SPI, and QPI modes for flexible data transfer rates up to 532 Mbits/s.
  • Includes hardware-based data protection mechanisms with top/bottom block protection and one-time programmable security register locks.
  • Enables execute-in-place (XIP) functionality with continuous read wrap capabilities to reduce latency.
  • Features low power consumption with typical standby current of 10 μA and deep power-down current of 1 μA.

Memory IC Applications

  • Embedded systems requiring code storage and execution.
  • Consumer electronics devices needing reliable non-volatile memory.
  • Industrial control applications utilizing secure boot processes.
  • IoT modules requiring low-power flash memory solutions.

Memory IC Procurement Notes

Verify the specific ordering suffix against the manufacturer's official datasheet to ensure correct package type and temperature range compatibility. Confirm that the required voltage level aligns with the 1.65 V to 2.0 V operating specification. Check for any special order requirements regarding status register protection modes or security lock configurations before finalizing procurement.

Memory IC Selection Notes

Select this component when a low-voltage (1.65 V–2.0 V) SPI NOR Flash is required for space-constrained designs. Ensure the host controller supports the necessary SPI modes including Quad I/O if high-speed data transfer is needed. Consider the SOP-8 package dimensions for PCB layout constraints and verify that the application benefits from the integrated security features like unique IDs and OTP locks.

Memory IC Part Context

This part belongs to the GD25LB series of Dual and Quad Serial Flash memories designed for uniform sector architectures. It shares interface protocols and command sets with other members of the GD25 family but is distinguished by its specific 1.65 V to 2.0 V voltage range and 32 Mbit density. The series targets applications demanding high performance and low power consumption.

Memory IC Replacement Considerations

GD25LE32ESIGR is listed as a parameter-equivalent substitute by distributors.

GD25LB32ESIGRGD25LB32ESIGR
$0.57
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