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GD25LB512MEY2GY is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 512MBIT SPI/QUAD 8WSON. Review the specifications below when checking this part for your BOM.
Memory IC specifications for GD25LB512MEY2GY
- Description：IC FLASH 512MBIT SPI/QUAD 8WSON
- Series：GD25LB
- Mfr：GigaDevice Semiconductor (HK) Limited
- Package：Tray
- Memory Type：Non-Volatile
- Memory Format：FLASH
- Technology：FLASH - NOR (SLC)
- Memory Size：512Mbit
- Memory Organization：64M x 8
- Memory Interface：SPI - Quad I/O, QPI, DTR
- Clock Frequency：133 MHz
- Write Cycle Time - Word, Page：-
- Voltage - Supply：1.65V ~ 2V
- Operating Temperature：-40°C ~ 105°C (TA)
- Mounting Type：Surface Mount
- Package / Case：8-WDFN Exposed Pad
- Supplier Device Package：8-WSON (6x8)
- Access Time：-
- Grade：-
- Qualification：-
Memory IC datasheet and documents for GD25LB512MEY2GY
Memory IC Overview
The GD25LB512MEY2GY is a 512 Mbit SPI NOR Flash memory device manufactured by GigaDevice. It operates within a supply voltage range of 1.65 V to 2.0 V and supports clock frequencies up to 166 MHz in standard modes. The component utilizes a TFBGA-24 package and provides a storage capacity of 64 M x 8 bits. It functions across an industrial temperature range from -40°C to +85°C.
Memory IC Feature Summary
- Supports Single I/O, Quad I/O, QPI, and DTR interface protocols for flexible data transfer.
- Integrates hardware-based ECC algorithms and CRC checksums for enhanced data integrity.
- Includes security registers with OTP locks and hardware reset functionality.
Memory IC Applications
- Industrial embedded systems requiring reliable code storage
- Automotive electronics compliant with AEC-Q100 standards
- IoT devices utilizing low-voltage power supplies
Memory IC Procurement Notes
Verify the specific suffix 'Y2GY' against official manufacturer documentation to confirm exact packaging and tape-and-reel specifications. Confirm RoHS compliance status and automotive qualification requirements directly with the supplier before procurement.
Memory IC Selection Notes
Select this component for designs requiring 512 Mbit density with strict low-voltage operation between 1.65 V and 2.0 V. Ensure the application environment remains within the specified -40°C to +85°C temperature range. Verify that the system supports the required SPI interface modes including Quad I/O or QPI.
Memory IC Part Context
This part belongs to the GD25LB series of SPI NOR Flash memories designed for high-performance and low-power applications. The series offers densities ranging from 512 Kbit to 2 Gbit and supports various voltage levels including 3V, 1.8V, and 1.65V~3.6V options.
Memory IC Replacement Considerations
GD25LB512MEBIRY: Similar 512 Mbit SPI NOR Flash with TFBGA-24 package and 1.65V~2.0V operation.
Memory IC FAQ
What is the maximum operating frequency?
The device supports clock frequencies up to 166 MHz in standard Single, Dual, and Quad I/O modes.
Does the device support hardware reset?
Yes, the GD25LB512MEY2GY includes a hardware reset function to ensure reliable device recovery.
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