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GD25LB512MFYJGR is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 512MBIT SPI/QUAD 8WSON. Review the specifications below when checking this part for your BOM.
Memory IC specifications for GD25LB512MFYJGR
- Description：IC FLASH 512MBIT SPI/QUAD 8WSON
- Series：GD25LB
- Mfr：GigaDevice Semiconductor (HK) Limited
- Package：Tape & Reel (TR)
- Memory Type：Non-Volatile
- Memory Format：FLASH
- Technology：FLASH - NOR (SLC)
- Memory Size：512Mbit
- Memory Organization：64M x 8
- Memory Interface：SPI - Quad I/O, QPI
- Clock Frequency：-
- Write Cycle Time - Word, Page：-
- Voltage - Supply：1.65V ~ 2V
- Operating Temperature：-40°C ~ 105°C (TA)
- Mounting Type：Surface Mount
- Package / Case：8-WDFN Exposed Pad
- Supplier Device Package：8-WSON (6x8)
- Access Time：-
- Grade：-
- Qualification：-
Memory IC datasheet and documents for GD25LB512MFYJGR
Memory IC Overview
The GD25LB512MFYJGR is a 512 Mbit SPI NOR Flash memory device manufactured by GigaDevice. It operates within a supply voltage range of 1.65 V to 2.0 V and supports clock frequencies up to 133 MHz in Single, Dual, Quad I/O, and QPI modes. The memory organization is 64 M x 8 bits. It features an 8-pin WSON package (6x8 mm) and is rated for industrial temperature ranges including -40°C to +85°C, -40°C to +105°C, and -40°C to +125°C.
Memory IC Feature Summary
- Supports high-speed serial communication via SPI, Dual I/O, Quad I/O, and QPI interfaces with a maximum frequency of 133 MHz.
- Includes hardware reset functionality, write protect pins, and security registers with OTP locks for data integrity.
- Offers unique identification capabilities and suspend/resume functions for efficient system management.
Memory IC Applications
- Industrial control systems requiring reliable code storage
- Automotive electronics applications
- Consumer electronic devices
Memory IC Procurement Notes
Verify the specific suffix YJGR against the official datasheet to confirm the exact package type and temperature grade. Ensure compatibility with the target system's voltage levels, as this component operates at 1.65 V to 2.0 V. Confirm that the required operating temperature range matches the specific variant ordered.
Memory IC Selection Notes
Select this component when low voltage operation between 1.65 V and 2.0 V is required. It is suitable for designs needing 512 Mbit density in a compact 8-pin WSON footprint. Consider the available industrial temperature grades (-40°C to +125°C) for harsh environment deployments.
Memory IC Part Context
This part belongs to the GD25LB series of SPI NOR Flash memories from GigaDevice. The series is characterized by its support for low voltage operation and high performance. It shares common interface protocols and feature sets with other members of the GD25 family, such as the GD25LR and GD25LT series.
Memory IC Replacement Considerations
Check for pin-compatible alternatives within the GD25LB or GD25LT series. Verify if higher speed variants like those supporting 200 MHz are acceptable for the design requirements.
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