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GD25LD05CEIGR is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLSH 512KBIT SPI/DUAL 8USON. Review the specifications below when checking this part for your BOM.
The GD25LD05CEIGR is a 512 Kbit NOR flash memory device manufactured by GigaDevice. It operates within a supply voltage range of 1.65 V to 2 V and features an SPI interface with a maximum clock frequency of 50 MHz. The memory organization is specified as 64 k x 8 bits, supporting an active read current of up to 10 mA. This component is housed in an USON-8 package measuring 3x2x0.45 mm and is rated for industrial operating temperatures ranging from -40°C to +85°C.
Verify the specific suffix 'IGR' corresponds to the tape-and-reel packaging format and industrial temperature grade. Confirm that the 1.8V supply requirement aligns with the target system's voltage rails. Ensure ESD protection measures are implemented during handling due to moisture sensitivity classification. Cross-reference the datasheet revision to confirm pinout compatibility with existing board layouts.
Select this part when a small 512 Kbit capacity is sufficient for code or data storage. The 1.8V operating range distinguishes it from standard 3.3V or 5V flash memories. Consider the USON-8 footprint constraints against available PCB real estate. Evaluate the 50 MHz speed limit against system bus requirements to ensure adequate performance without unnecessary cost overhead.
This component belongs to the GD25LD05C series of uniform sector standard NOR flash memories. It shares architectural similarities with other members of the GD25LD family but is distinguished by its specific voltage and package configuration. The series targets applications needing moderate density with low power consumption profiles.
GD25LD05EKIGR offers dual SPI support within the same package and voltage range. GD25D05CEIGR provides higher speed capabilities but requires a different supply voltage range. Verify electrical compatibility before substituting these alternatives.
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