Memory IC GD25LD20EK6IGR product image

GD25LD20EK6IGR

$0.26
  • Description:IC FLASH 2MBIT SPI/DUAL 6USON
  • Series:GD25LD
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR)

SKU:7187dcb86d42 Category: Brand:

  
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GD25LD20EK6IGR is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 2MBIT SPI/DUAL 6USON. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GD25LD20EK6IGR

  • Description:IC FLASH 2MBIT SPI/DUAL 6USON
  • Series:GD25LD
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR)
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NOR (SLC)
  • Memory Size:2Mbit
  • Memory Organization:256K x 8
  • Memory Interface:SPI - Dual I/O
  • Clock Frequency:50 MHz
  • Write Cycle Time - Word, Page:100µs, 6ms
  • Voltage - Supply:1.65V ~ 2V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:6-XFDFN
  • Supplier Device Package:6-USON (1.2x1.2)
  • Access Time:12 ns
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for GD25LD20EK6IGR

GD25LD20EK6IGR

Memory IC Overview

The GD25LD20EK6IGR is a 2 Mbit NOR flash memory device manufactured by GigaDevice. It features a USON-6 surface-mount package and operates within a supply voltage range of 1.65 V to 2 V. The component supports Dual SPI and standard SPI interfaces with a maximum clock frequency of 50 MHz. It provides a storage capacity organized as 256 k x 8 bits, with a maximum active read current of 2 mA. The device functions reliably across an industrial temperature range from -40°C to +85°C.

Memory IC Feature Summary

  • Supports Dual I/O and standard SPI communication protocols for flexible system integration.
  • Operates at low voltage levels suitable for power-constrained embedded applications.
  • Provides non-volatile data retention with synchronous timing characteristics.

Memory IC Applications

  • Embedded systems requiring low-power code storage
  • Industrial control devices operating in wide temperature ranges
  • Consumer electronics utilizing small form-factor memory solutions

Memory IC Procurement Notes

Verify the specific suffix EK6IGR against official GigaDevice documentation to confirm package type and temperature grade. Ensure compatibility with 1.65V to 2V supply rails during design validation. Confirm RoHS compliance status through manufacturer certificates prior to procurement.

Memory IC Selection Notes

Select this component when a compact USON-6 footprint is required alongside low-voltage operation. Compare performance metrics such as read current and clock speed against alternative 2 Mbit NOR options. Validate that the Dual SPI interface meets the bandwidth requirements of the target application architecture.

Memory IC Part Context

This part belongs to the GD25LD series of low-voltage NOR flash memories. It shares architectural similarities with other devices in the family but differs in package configuration and specific electrical parameters. The series targets applications demanding high density in minimal physical space.

Memory IC Replacement Considerations

GD25LD20CKIGR offers similar specifications but utilizes an 8-pin package instead of the 6-pin USON format. Verify pinout compatibility and thermal dissipation requirements before substituting components in existing designs.

GD25LD20EK6IGRGD25LD20EK6IGR
$0.26
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