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GD25LD40COIGR is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 4MBIT SPI/DUAL 8TSSOP. Review the specifications below when checking this part for your BOM.
Memory IC specifications for GD25LD40COIGR
- Description：IC FLASH 4MBIT SPI/DUAL 8TSSOP
- Series：-
- Mfr：GigaDevice Semiconductor (HK) Limited
- Package：Tape & Reel (TR)
- Memory Type：Non-Volatile
- Memory Format：FLASH
- Technology：FLASH - NOR
- Memory Size：4Mbit
- Memory Organization：512K x 8
- Memory Interface：SPI - Dual I/O
- Clock Frequency：50 MHz
- Write Cycle Time - Word, Page：97µs, 6ms
- Voltage - Supply：1.65V ~ 2V
- Operating Temperature：-40°C ~ 85°C (TA)
- Mounting Type：Surface Mount
- Package / Case：8-TSSOP (0.173", 4.40mm Width)
- Supplier Device Package：8-TSSOP
- Access Time：-
- Grade：-
- Qualification：-
Memory IC datasheet and documents for GD25LD40COIGR
Memory IC Overview
The GD25LD40COIGR is a 4 Mbit NOR flash memory device manufactured by GigaDevice. It features an SPI interface with a maximum clock frequency of 50 MHz and a data bus width of 8 bits. The memory organization is 512 k x 8. Operating voltage ranges from 1.65 V to 2 V, with a maximum active read current of 10 mA. It supports surface mount installation in a TSSOP-8 package (173mil). The component operates within an industrial temperature range of -40°C to +85°C and is supplied in a reel.
Memory IC Feature Summary
- Supports standard SPI communication protocols for reliable data transfer
- Designed for low-voltage operation suitable for portable applications
- Industrial temperature rating ensures stability in demanding environments
Memory IC Applications
- Firmware storage in consumer electronics
- Code execution in embedded systems
- Data logging in industrial controllers
Memory IC Procurement Notes
Verify the specific suffix 'OIGR' corresponds to the TSSOP-8 package and tape-and-reel delivery format as listed in official distributor catalogs. Confirm that the 1.8V supply requirement aligns with your system design before procurement. Ensure handling procedures account for moisture sensitivity level requirements during assembly.
Memory IC Selection Notes
Select this component when a 4 Mbit capacity is required with strict low-voltage constraints between 1.65 V and 2 V. The TSSOP-8 package offers a compact footprint for space-constrained designs. Verify compatibility with existing SPI controllers supporting up to 50 MHz clock speeds.
Memory IC Part Context
This part belongs to the GD25LD40C series of NOR flash memories. It shares core specifications with variants like GD25LD40CTIGR but differs in physical packaging. The series is designed for cost-effective storage solutions requiring moderate performance and low power consumption.
Memory IC Replacement Considerations
GD25LD40CTIGR serves as a functional alternative with identical electrical characteristics but utilizes an SOP-8 package instead of TSSOP-8. Verify pinout compatibility and board layout adjustments if substituting.
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