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GD25LD40EK6IGR is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 4MBIT SPI/DUAL 6USON. Review the specifications below when checking this part for your BOM.
Memory IC specifications for GD25LD40EK6IGR
- Description：IC FLASH 4MBIT SPI/DUAL 6USON
- Series：GD25LD
- Mfr：GigaDevice Semiconductor (HK) Limited
- Package：Tape & Reel (TR)
- Memory Type：Non-Volatile
- Memory Format：FLASH
- Technology：FLASH - NOR (SLC)
- Memory Size：4Mbit
- Memory Organization：512K x 8
- Memory Interface：SPI - Dual I/O
- Clock Frequency：50 MHz
- Write Cycle Time - Word, Page：100µs, 6ms
- Voltage - Supply：1.65V ~ 2V
- Operating Temperature：-40°C ~ 85°C (TA)
- Mounting Type：Surface Mount
- Package / Case：6-XFDFN
- Supplier Device Package：6-USON (1.2x1.2)
- Access Time：12 ns
- Grade：-
- Qualification：-
Memory IC datasheet and documents for GD25LD40EK6IGR
Memory IC Overview
The GD25LD40EK6IGR is a 4 Mbit NOR flash memory device manufactured by GigaDevice. It features a USON-6 surface-mount package and operates within a supply voltage range of 1.65 V to 2 V. The component supports Dual SPI and standard SPI interfaces with a maximum clock frequency of 50 MHz. It has an active read current of up to 2 mA and a memory organization of 512 k x 8 bits. The device functions reliably across an industrial temperature range from -40°C to +85°C.
Memory IC Feature Summary
- Supports Dual SPI and standard SPI interface protocols for flexible system integration
- Operates at low voltage levels between 1.65 V and 2 V for power efficiency
- Designed for industrial applications with extended temperature stability
Memory IC Applications
- Industrial control systems requiring low-power non-volatile storage
- Consumer electronics utilizing 1.8V logic domains
- Embedded firmware storage in compact mobile devices
Memory IC Procurement Notes
Verify the specific suffix EK6IGR against official GigaDevice documentation to confirm package type and tape-and-reel specifications. Ensure compatibility with 1.8V power rails and USON-6 footprint requirements during procurement planning. Confirm RoHS compliance status through manufacturer datasheets prior to ordering.
Memory IC Selection Notes
Select this component when a small USON-6 footprint is required alongside low-voltage operation. Compare performance metrics such as 50 MHz clock speed and 2 mA read current against alternative 4 Mbit NOR options. Evaluate thermal management needs for the -40°C to +85°C operating range in final designs.
Memory IC Part Context
This part belongs to the GD25LD40C series of NOR flash memories. It shares architectural similarities with other devices in the family but differs in packaging and voltage specifications. The USON-6 variant offers a compact solution compared to larger SOP or TSSOP packages available in the same product line.
Memory IC Replacement Considerations
GD25LD40COIGR (TSSOP-8 package)
Memory IC FAQ
What is the maximum clock frequency supported by this device?
The GD25LD40EK6IGR supports a maximum clock frequency of 50 MHz.
Does this component support Dual SPI mode?
Yes, the device supports both standard SPI and Dual SPI interface modes.
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