Memory IC GD25LE128E3IRR product image

GD25LE128E3IRR

$1.20
  • Description:IC FLSH 128MBIT SPI/QUAD 26WLCSP
  • Series:GD25LE
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR)

SKU:ea56e4ae3d13 Category: Brand:

  
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GD25LE128E3IRR is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLSH 128MBIT SPI/QUAD 26WLCSP. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GD25LE128E3IRR

  • Description:IC FLSH 128MBIT SPI/QUAD 26WLCSP
  • Series:GD25LE
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR)
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NOR (SLC)
  • Memory Size:128Mbit
  • Memory Organization:16M x 8
  • Memory Interface:SPI - Quad I/O, QPI
  • Clock Frequency:133 MHz
  • Write Cycle Time - Word, Page:60µs, 2.4ms
  • Voltage - Supply:1.65V ~ 2V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:26-XFBGA, WLCSP
  • Supplier Device Package:26-WLCSP
  • Access Time:6 ns
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for GD25LE128E3IRR

GD25LE128E3IRR

Memory IC Overview

The GD25LE128E3IRR is a 128 Mbit SPI NOR Flash memory device manufactured by GigaDevice. It utilizes a WLCSP-26 surface-mount package and operates within a supply voltage range of 1.65 V to 2 V. The component supports an SPI interface with Quad I/O and QPI modes, achieving a maximum clock frequency of 133 MHz. It features a read access time of 6 ns and maintains an active read current maximum of 9 mA. The device is rated for industrial operating temperatures between -40°C and +85°C.

Memory IC Feature Summary

  • Supports high-speed SPI communication with Quad I/O and QPI protocols for efficient data transfer.
  • Designed for ultra-low power consumption suitable for battery-powered applications.
  • Utilizes a compact WLCSP-26 package for space-constrained designs.

Memory IC Applications

  • Battery-powered consumer electronics
  • Wearable devices
  • IoT modules

Memory IC Procurement Notes

Verify the specific suffix E3IRR against official datasheets to confirm the WLCSP-26 packaging and 1.65V-2V voltage range. Ensure compatibility with system voltage rails before integration. Confirm lead times and availability directly with authorized distributors as stock levels fluctuate. Validate that the required quantity meets minimum order specifications provided by the supplier.

Memory IC Selection Notes

Select this component when a small form factor is critical due to its WLCSP-26 footprint. It is appropriate for systems requiring low standby and active power consumption. Ensure the host controller supports the necessary SPI modes. Verify that the 1.65V to 2V operating range aligns with the target application's power supply design constraints.

Memory IC Part Context

This part belongs to the GD25LE series, which focuses on ultra-low power performance. The series targets applications demanding extended battery life and compact physical dimensions. It complements other GigaDevice flash products by offering specialized low-voltage operation in advanced packaging technologies.

Memory IC Replacement Considerations

Check for pin-compatible alternatives within the same GD25LE family. Verify if different density options or package types like SOP-16 are available from the manufacturer. Ensure any substitute matches the 1.65V-2V voltage specification and 133 MHz speed requirement.

GD25LE128E3IRRGD25LE128E3IRR
$1.20
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