Memory IC GD25LE128EQEGR product image

GD25LE128EQEGR

$1.54
  • Description:IC FLASH 128MBIT SPI/QUAD 8USON
  • Series:GD25LE
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR)

SKU:7e8a31604410 Category: Brand:

  
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GD25LE128EQEGR is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 128MBIT SPI/QUAD 8USON. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GD25LE128EQEGR

  • Description:IC FLASH 128MBIT SPI/QUAD 8USON
  • Series:GD25LE
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR)
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NOR (SLC)
  • Memory Size:128Mbit
  • Memory Organization:16M x 8
  • Memory Interface:SPI - Quad I/O, QPI
  • Clock Frequency:133 MHz
  • Write Cycle Time - Word, Page:100µs, 4ms
  • Voltage - Supply:1.65V ~ 2V
  • Operating Temperature:-40°C ~ 125°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:8-XDFN Exposed Pad
  • Supplier Device Package:8-USON (4x4)
  • Access Time:6 ns
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for GD25LE128EQEGR

GD25LE128EQEGR

Memory IC Overview

The GD25LE128EQEGR is a 128 Mbit (16M x 8) SPI NOR flash memory manufactured by GigaDevice. It operates within a supply voltage range of 1.65 V to 2 V and supports a maximum clock frequency of 133 MHz. The device features an active read current of up to 9 mA and utilizes an 8-USON surface-mount package. It is designed for non-volatile data storage with standard SPI and Quad I/O interfaces.

Memory IC Feature Summary

  • Supports high-speed serial communication via SPI and Quad I/O interfaces
  • Provides reliable non-volatile code and data storage capabilities
  • Engineered for low-power consumption in portable electronic applications

Memory IC Applications

  • Embedded systems requiring compact code storage
  • Consumer electronics with limited power budgets
  • Industrial control devices needing reliable firmware retention

Memory IC Procurement Notes

Verify the specific suffix 'QE' against the manufacturer's official datasheet to confirm the exact package dimensions and tape-and-reel specifications. Ensure that the system design strictly adheres to the 1.65 V to 2 V operating voltage limits, as exceeding these values may damage the component. Confirm compatibility with the target PCB footprint for the 8-USON package before finalizing procurement orders.

Memory IC Selection Notes

Select this component when a small form factor is required alongside low-voltage operation constraints. The 128 Mbit density offers sufficient capacity for moderate-sized firmware images. Consider the 133 MHz speed capability if higher throughput is necessary compared to slower legacy alternatives. Evaluate the USON package size against available board space requirements.

Memory IC Part Context

This part belongs to the GD25LE series of SPI NOR flash memories from GigaDevice. The series is characterized by its focus on low-voltage operation and compact packaging solutions suitable for modern miniaturized electronic devices. It serves as a cost-effective alternative for general-purpose storage needs where extreme automotive or industrial temperature ranges are not the primary design drivers.

Memory IC Replacement Considerations

Direct replacements include other GD25LE128 variants with compatible pinouts such as GD25LE128EWIGR or GD25LE128EXHIGR, provided the package type matches the existing PCB layout. Verify electrical parameters like voltage range and interface speeds before substitution.

GD25LE128EQEGRGD25LE128EQEGR
$1.54
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