Memory IC GD25LE128ESIGR product image

GD25LE128ESIGR

$1.81
  • Description:IC FLASH 128MBIT SPI/QUAD 8SOP
  • Series:-
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR),Cut Tape (CT)

SKU:ad99edda2f4e Category: Brand:

  
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GD25LE128ESIGR is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 128MBIT SPI/QUAD 8SOP. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GD25LE128ESIGR

  • Description:IC FLASH 128MBIT SPI/QUAD 8SOP
  • Series:-
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR),Cut Tape (CT)
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NOR (SLC)
  • Memory Size:128Mbit
  • Memory Organization:16M x 8
  • Memory Interface:SPI - Quad I/O, QPI
  • Clock Frequency:133 MHz
  • Write Cycle Time - Word, Page:60µs, 2.4ms
  • Voltage - Supply:1.65V ~ 2V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:8-SOIC (0.209", 5.30mm Width)
  • Supplier Device Package:8-SOP
  • Access Time:6 ns
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for GD25LE128ESIGR

GD25LE128ESIGR

Memory IC Overview

The GD25LE128ESIGR is a 128 Mbit NOR flash memory device manufactured by GigaDevice. It utilizes an SPI interface with support for Quad I/O operations and operates at a maximum clock frequency of 133 MHz. The component functions within a supply voltage range of 1.65 V to 2 V, featuring a maximum active read current of 9 mA. It is housed in an 8-SOP surface-mount package and supports a storage organization of 16M x 8 bits. The device is rated for industrial operating temperatures ranging from -40°C to +85°C.

Memory IC Feature Summary

  • Supports standard SPI and Quad I/O modes for flexible data transfer
  • Operates at high clock frequencies up to 133 MHz
  • Compatible with low-voltage power supplies between 1.65 V and 2 V

Memory IC Applications

  • Embedded systems requiring code storage
  • Consumer electronics firmware applications
  • Industrial control system data logging

Memory IC Procurement Notes

Verify the specific suffix 'IGR' against official manufacturer documentation to confirm the exact tape-and-reel packaging configuration and moisture sensitivity level. Ensure that the 1.65 V to 2 V voltage range aligns with your target system's power rails, as this device does not support higher voltage inputs. Cross-reference the SOP-8 footprint dimensions with your PCB design guidelines before finalizing procurement.

Memory IC Selection Notes

Select this component when a 128 Mbit density is required alongside a narrow 1.65 V to 2 V operating window. The 8-SOP package offers a compact solution for space-constrained designs compared to larger packages. Consider the 133 MHz speed capability if high-throughput code execution is necessary, while noting the specific temperature range limits suitability for extreme environmental conditions.

Memory IC Part Context

This part belongs to the GD25LE128E series of SPI NOR flash memories from GigaDevice. The series is designed for general-purpose non-volatile storage applications. The 'L' designation typically indicates the specific voltage and feature set within the broader GD25 family. This series competes in the embedded storage market by providing reliable data retention and standardized interface compatibility.

Memory IC Replacement Considerations

Check for GD25LE128EWJGR or GD25LE128EQIGR if alternative SOP or USON packages are needed. Verify pinout compatibility before substituting with other 128 Mbit SPI NOR devices.

GD25LE128ESIGRGD25LE128ESIGR
$1.81
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