Memory IC GD25LE128EWIGR product image

GD25LE128EWIGR

$1.14
  • Description:IC FLASH 128MBIT SPI/QUAD 8WSON
  • Series:GD25LE
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR)

SKU:bf4721edbf57 Category: Brand:

  
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GD25LE128EWIGR is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 128MBIT SPI/QUAD 8WSON. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GD25LE128EWIGR

  • Description:IC FLASH 128MBIT SPI/QUAD 8WSON
  • Series:GD25LE
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR)
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NOR (SLC)
  • Memory Size:128Mbit
  • Memory Organization:16M x 8
  • Memory Interface:SPI - Quad I/O, QPI
  • Clock Frequency:133 MHz
  • Write Cycle Time - Word, Page:60µs, 2.4ms
  • Voltage - Supply:1.65V ~ 2V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:8-WDFN Exposed Pad
  • Supplier Device Package:8-WSON (5x6)
  • Access Time:6 ns
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for GD25LE128EWIGR

GD25LE128EWIGR

Memory IC Overview

The GD25LE128EWIGR is a 128 Mbit NOR flash memory device manufactured by GigaDevice. It features an SPI interface with a maximum clock frequency of 133 MHz and supports Quad I/O modes. The storage organization is 16 M x 8 bits. Operating voltage ranges from 1.65 V to 2 V, with a maximum active read current of 9 mA. The component operates within a temperature range of -40°C to +85°C and is housed in an 8-pin WSON package.

Memory IC Feature Summary

  • Supports standard SPI and Quad I/O interfaces for flexible data transfer options.
  • Operates at low supply voltages suitable for portable applications.
  • Provides high-speed serial access with up to 133 MHz clock frequency.

Memory IC Applications

  • Embedded systems requiring non-volatile code storage
  • Consumer electronics with limited power budgets
  • Industrial control devices needing reliable firmware retention

Memory IC Procurement Notes

Verify the specific suffix 'WIGR' corresponds to the WSON-8 package and tape-and-reel or cut-tape availability as listed by distributors. Confirm moisture sensitivity level (MSL 3) handling requirements during assembly. Ensure the 1.65V to 2V operating voltage aligns with the target system's power rail specifications before integration.

Memory IC Selection Notes

Select this part when low voltage operation between 1.65V and 2V is required. Compare against GD25Q128E variants if 2.7V to 3.6V supplies are available, noting the difference in active current consumption. Verify that the WSON-8 footprint matches the PCB design constraints.

Memory IC Part Context

This component belongs to the GD25LE128E series of SPI NOR flash memories. It shares core specifications with other members like GD25LE128EQIGR but differs in package type, using WSON-8 instead of USON-8. The series is designed for cost-sensitive applications requiring moderate performance and low power consumption.

Memory IC Replacement Considerations

GD25LE128EQIGR offers identical electrical specifications but utilizes an USON-8 package instead of WSON-8. Designers must verify pin compatibility and physical footprint differences before substituting.

GD25LE128EWIGRGD25LE128EWIGR
$1.14
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