GD25LE128EWJGR

$1.35

Description：IC FLASH 128MBIT SPI/QUAD 8WSON
Series：GD25LE
Mfr：GigaDevice Semiconductor (HK) Limited
Package：Tape & Reel (TR)

SKU:6dd237cd8847 Category: Memory IC Brand: GigaDevice Semiconductor (HK) Limited

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Product introduction

GD25LE128EWJGR is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 128MBIT SPI/QUAD 8WSON. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GD25LE128EWJGR

Description：IC FLASH 128MBIT SPI/QUAD 8WSON
Series：GD25LE
Mfr：GigaDevice Semiconductor (HK) Limited
Package：Tape & Reel (TR)
Memory Type：Non-Volatile
Memory Format：FLASH
Technology：FLASH - NOR (SLC)
Memory Size：128Mbit
Memory Organization：16M x 8
Memory Interface：SPI - Quad I/O, QPI
Clock Frequency：133 MHz
Write Cycle Time - Word, Page：60µs, 2.4ms
Voltage - Supply：1.65V ~ 2V
Operating Temperature：-40°C ~ 105°C (TA)
Mounting Type：Surface Mount
Package / Case：8-WDFN Exposed Pad
Supplier Device Package：8-WSON (5x6)
Access Time：6 ns
Grade：-
Qualification：-

Memory IC datasheet and documents for GD25LE128EWJGR

GD25LE128EWJGR

Memory IC Overview

The GD25LE128EWJGR is a 128 Mbit SPI NOR Flash memory device manufactured by GigaDevice. It features a storage organization of 16 M x 8 bits and supports standard SPI, Quad I/O, and QPI interfaces with a maximum clock frequency of 133 MHz. The component operates within a supply voltage range of 1.65 V to 2 V and is housed in an 8-WSON (5x6) package. It supports uniform sector architecture for data retention and endurance.

Memory IC Feature Summary

Ultra-low power consumption optimized for battery-powered applications
Supports Dual and Quad Serial Peripheral Interface modes
Uniform sector architecture for flexible block protection

Memory IC Applications

Battery-powered IoT devices
Wearable electronics
Consumer electronics requiring extended battery life

Memory IC Procurement Notes

Verify the specific suffix 'J' against official datasheets to confirm temperature grade and tape/reel specifications. Ensure compatibility with 1.65V to 2V supply rails. Confirm moisture sensitivity level requirements for surface mount assembly processes.

Memory IC Selection Notes

Select this part for designs prioritizing minimal power usage over high-voltage tolerance. Compare against the GD25LE128EQIGR if USON-8 packaging is preferred. Verify that the 1.65V minimum voltage meets system power rail stability.

Memory IC Part Context

This component belongs to the GD25LE series, which targets ultra-low power applications. It differs from the GD25Q series by operating at lower voltages (1.65V–2V vs 2.7V–3.6V). The WSON package offers a compact footprint suitable for space-constrained portable devices.