GD25LE128EWJGY

Memory IC Overview

The GD25LE128EWJGY is a 128 Mbit SPI NOR Flash memory device manufactured by GigaDevice. It features an 8-bit data bus width and supports Quad I/O and QPI interfaces with a maximum clock frequency of 133 MHz. The storage organization is 16 M x 8. Operating voltage ranges from 1.65 V to 2 V, with a maximum active read current of 9 mA. The component is housed in an 8-WSON (5x6 mm) package and operates within a temperature range of -40°C to +105°C.

Memory IC Feature Summary

• Supports Single, Dual, and Quad SPI interfaces including QPI mode for high-speed data transfer
• Ultra-low power consumption design optimized for battery-powered applications
• Uniform sector architecture enabling flexible code execution and data storage

Memory IC Applications

• Battery-powered consumer electronics requiring extended operational life
• Wearable devices with compact form factor constraints
• IoT sensors and health monitoring systems

Memory IC Procurement Notes

Verify the specific suffix 'WJGY' against the official datasheet to confirm the exact tape-and-reel packaging configuration and moisture sensitivity level. Ensure the ordering documentation matches the 8-WSON (5x6mm) physical dimensions. Confirm that the supply chain source provides valid traceability for this specific manufacturing lot.

Memory IC Selection Notes

Select this component when a low-voltage 1.8V operation is required alongside ultra-low power characteristics. The 133 MHz speed suits moderate-performance embedded applications. Compare against the GD25LQ series if higher clock frequencies up to 166 MHz are necessary, or against the GD25WD/WQ series if a wider voltage range extending to 3.6V is needed for system flexibility.

Memory IC Part Context

This part belongs to the GD25LE series, which focuses on ultra-low power performance. It shares the 128 Mbit density and 1.65V-2V operating range with other members like the GD25LE128EWIGR. The primary distinction lies in the specific package variant and manufacturing batch identifiers encoded in the suffix.

Memory IC Replacement Considerations

GD25LE128EWIGR: Identical electrical specifications and capacity; verify package compatibility. GD25LQ128EYJGR: Higher clock frequency support but requires verification of pinout and voltage tolerance alignment.