GD25LE128EXHEGR

Memory IC Overview

The GD25LE128EXHEGR is a 128 Mbit NOR flash memory device manufactured by GigaDevice. It features a storage organization of 16 M x 8 and supports Dual/Quad SPI, QPI, and standard SPI interfaces with a maximum clock frequency of 133 MHz. The component operates within a supply voltage range of 1.65 V to 2 V and draws a maximum active read current of 9 mA. It is housed in an 8-FO-USON package and is designed for surface mount installation. The device supports synchronous timing and functions reliably across an extended industrial temperature range from -40°C to +125°C.

Memory IC Feature Summary

• Supports high-speed data transfer via Quad SPI and QPI modes at frequencies up to 133 MHz.
• Operates on a low-voltage power supply ranging from 1.65 V to 2 V.
• Engineered for reliable performance in demanding environments with an extended operating temperature range.
• Utilizes a compact surface-mount package suitable for space-constrained electronic designs.

Memory IC Applications

• Code storage applications requiring fast random access capabilities
• Industrial control systems operating in extreme temperature conditions
• Embedded systems utilizing serial flash memory architectures
• Consumer electronics devices requiring non-volatile data retention

Memory IC Procurement Notes

Verify the specific suffix HEGR against official datasheets to confirm the exact package type and tape-and-reel specifications. Ensure compatibility with the target system's voltage levels, as the device requires a strict 1.65 V to 2 V supply range. Confirm that the design accommodates the 8-FO-USON footprint and meets the required thermal management standards for operation up to 125°C. Cross-reference RoHS compliance status with current regulatory requirements before finalizing procurement decisions.

Memory IC Selection Notes

Select this component when a 128 Mbit density is required alongside support for Quad SPI and QPI protocols. It is appropriate for designs needing operation at clock speeds up to 133 MHz under low voltage conditions. Consider this part if the application demands an extended temperature range extending to 125°C. Verify that the 8-FO-USON package dimensions fit within the available PCB area constraints.

Memory IC Part Context

This component belongs to the GD25LE series of NOR flash memories from GigaDevice. The series provides various densities and interface options tailored for code execution and data storage. The GD25LE128EXHEGR specifically offers a balance of speed and power efficiency within a compact form factor, targeting modern embedded applications.

Memory IC Replacement Considerations

Consult official substitution guides for verified equivalents. Other variants within the GD25LE128E family may share similar electrical characteristics but differ in package types or temperature ratings. Ensure any substitute matches the 1.65 V to 2 V voltage requirement and 133 MHz interface speed.