Memory IC GD25LE128EXHIGR product image

GD25LE128EXHIGR

$1.82
  • Description:SERIAL NOR FLASH
  • Series:GD25LE
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR),Cut Tape (CT)

SKU:dcecd36818c4 Category: Brand:

  
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GD25LE128EXHIGR is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is SERIAL NOR FLASH. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GD25LE128EXHIGR

  • Description:SERIAL NOR FLASH
  • Series:GD25LE
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR),Cut Tape (CT)
  • Memory Type:-
  • Memory Format:-
  • Technology:-
  • Memory Size:-
  • Memory Organization:-
  • Memory Interface:-
  • Clock Frequency:-
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:-
  • Operating Temperature:-
  • Mounting Type:Surface Mount
  • Package / Case:8-XDFN Exposed Pad
  • Supplier Device Package:8-FO-USON8 (3x3)
  • Access Time:-
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for GD25LE128EXHIGR

GD25LE128EXHIGR

Memory IC Overview

The GD25LE128EXHIGR is a 128M-bit (16M x 8) Serial NOR Flash memory manufactured by GigaDevice. It operates on a single power supply voltage ranging from 1.65V to 2.0V and supports Standard, Dual, Quad SPI, and QPI interfaces with a maximum clock frequency of 133MHz. The device features uniform sector architecture with 4K-byte sectors and 32/64K-byte blocks. It includes advanced security features such as hardware/software write protection, 128-bit unique ID, and serial flash discoverable parameters.

Memory IC Feature Summary

  • Supports standard, dual, quad SPI, and QPI modes for flexible data transfer rates up to 532Mbits/s in Quad I/O and QPI configurations.
  • Provides comprehensive data protection via software block protect bits, hardware WP# pin control, and dedicated security registers with OTP locks.
  • Enables Execute In Place (XiP) operation with continuous read wrap functionality to reduce instruction fetch latency.
  • Features ultra-low power consumption with typical standby current of 11μA and deep power-down current of 0.2μA.

Memory IC Applications

  • Code storage for microcontrollers and system-on-chips requiring high-speed boot execution.
  • Data logging and configuration storage in battery-powered IoT devices due to low power characteristics.
  • Firmware storage in consumer electronics and industrial control systems needing reliable non-volatile memory.
  • Secure applications utilizing hardware write protection and unique device identification features.

Memory IC Procurement Notes

Verify the specific suffix 'XHI' against the manufacturer's official ordering guide to confirm package type, temperature range, and tape/reel specifications. Ensure compatibility with the target system's voltage levels, as this part requires a 1.65V to 2.0V supply. Cross-reference the datasheet revision to confirm command set and electrical characteristics match your design requirements before finalizing procurement.

Memory IC Selection Notes

Select this component when a compact 128M-bit capacity is required with strict low-voltage constraints between 1.65V and 2.0V. The FO-USON8 package offers a small footprint suitable for space-constrained designs. Consider this part if high-speed Quad SPI or QPI interfaces are needed for efficient code execution. Evaluate the need for hardware write protection and security register features for your specific application security model.

Memory IC Part Context

This part belongs to the GD25LE series, which focuses on ultra-low power performance for battery-operated applications. The GD25LE128E variant specifically targets markets demanding extended battery life and compact form factors. It complements other densities in the family by providing a balance of speed, power efficiency, and storage capacity for modern embedded systems.

Memory IC Replacement Considerations

GD25LE128EXHEGR

Memory IC FAQ

What is the function of the HOLD#/RESET# pin?

The HOLD#/RESET# pin serves a dual function determined by the HOLD/RST bit in Status Register No. 3. When held low, it acts as a HOLD pin to pause serial communication. When held high, it functions as a RESET# pin to reset the device to standby mode.

How does the Quad Enable (QE) bit affect operations?

The QE bit must be set to 1 to enable Quad SPI and QPI modes. When QE is 0, the device operates in Standard or Dual SPI mode, and the HOLD#/RESET# pin retains its dedicated control functions rather than acting as a bidirectional I/O pin.

GD25LE128EXHIGRGD25LE128EXHIGR
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