GD25LE16CLIGR

Memory IC Overview

The GD25LE16CLIGR is a 16 Mbit NOR Flash memory device manufactured by GigaDevice. It features an SPI interface with a maximum clock frequency of 104 MHz and operates within a supply voltage range of 1.65 V to 2.1 V. The memory organization is 2 M x 8 bits, with a maximum active read current of 20 mA. It is housed in a WLCSP-8 package and supports industrial temperature ranges from -40°C to +85°C. The component is supplied in tape and reel packaging.

Memory IC Feature Summary

• Industrial-grade reliability for extended temperature operation
• Compact wafer-level chip-scale packaging
• Standard SPI interface compatibility

Memory IC Applications

• Industrial control systems
• Consumer electronics firmware storage
• IoT device code retention

Memory IC Procurement Notes

Verify the NRND status before integration, as this indicates the component is not recommended for new designs. Confirm that the WLCSP-8 package aligns with your PCB layout capabilities. Ensure the 1.8V supply domain matches the specified 1.65V to 2.1V operating range. Check for moisture sensitivity handling requirements during assembly.

Memory IC Selection Notes

Select this part only if the 16 Mbit density and 104 MHz speed meet system requirements. The WLCSP-8 package requires specific surface mount technology considerations. Verify that the industrial temperature range covers your operational environment. Consider the end-of-life status when planning long-term production cycles.

Memory IC Part Context

This component belongs to the GD25LE16C series of ultra-low power SPI NOR Flash memories. It is designed for applications requiring small form factors and efficient power consumption. The series targets embedded systems where space constraints and battery life are critical design parameters.

Memory IC Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided documentation.