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GD25LE16E3IGR is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 16MBIT SPI/QUAD 8WLCSP. Review the specifications below when checking this part for your BOM.
The GD25LE16E3IGR is a 16M-bit (2M x 8) Serial NOR Flash memory device manufactured by GigaDevice. It operates on a single power supply voltage ranging from 1.65V to 2.0V and supports Standard, Dual, Quad SPI, and QPI interfaces with a maximum clock frequency of 133MHz. The device features uniform sector architecture with 4K-byte sectors and 32/64K-byte blocks. It includes advanced security features such as 128-bit unique ID, software/hardware write protection, and three 3x1024-byte security registers with OTP locks. The component is housed in an 8-WLCSP package.
Verify the specific ordering suffix against the manufacturer's official datasheet to confirm package type and temperature range. Ensure compatibility with the target system's voltage levels, as this device requires a 1.65V to 2.0V supply. Confirm that the required interface mode (Standard, Dual, Quad, or QPI) is supported by the host controller. Check for any specific revision history updates that may affect command sets or electrical characteristics before finalizing procurement.
Select this component when a low-voltage, small-footprint NOR flash solution is required for code execution or data storage. The WLCSP package offers a compact form factor suitable for space-constrained designs. Consider the 133MHz clock speed and Quad I/O capabilities if high-speed read performance is critical for application responsiveness. Ensure the design accounts for the specific power supply requirements and supports the necessary SPI protocol modes.
This part belongs to the GD25LE series of Serial NOR Flash memories from GigaDevice. The series is designed for applications requiring high reliability and low power consumption. The 'E' suffix typically denotes enhanced features or specific process nodes within the family. The 'I' indicates industrial temperature range availability, while 'GR' specifies the tape and reel packaging format for surface-mount assembly.
GD25LE16ETIGR: Different package (SOP-8 vs WLCSP). GD25LE16EEIGR: Different package (USON-8 vs WLCSP). Verify pinout compatibility and physical dimensions when substituting.
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