Memory IC GD25LE16ETIGR product image

GD25LE16ETIGR

$0.45
  • Description:IC FLASH 16MBIT SPI/QUAD 8SOP
  • Series:GD25LE
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR)

SKU:ef495304d7c7 Category: Brand:

  
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GD25LE16ETIGR is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 16MBIT SPI/QUAD 8SOP. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GD25LE16ETIGR

  • Description:IC FLASH 16MBIT SPI/QUAD 8SOP
  • Series:GD25LE
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR)
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NOR (SLC)
  • Memory Size:16Mbit
  • Memory Organization:2M x 8
  • Memory Interface:SPI - Quad I/O, QPI
  • Clock Frequency:133 MHz
  • Write Cycle Time - Word, Page:60µs, 2.4ms
  • Voltage - Supply:1.65V ~ 2V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:8-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package:8-SOP
  • Access Time:6 ns
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for GD25LE16ETIGR

GD25LE16ETIGR

Memory IC Overview

The GD25LE16ETIGR is a 16 Mbit NOR flash memory device manufactured by GigaDevice. It utilizes an SPI interface with a maximum clock frequency of 133 MHz and supports a 2 M x 8 organization. The component operates within a supply voltage range of 1.65 V to 2 V, featuring a maximum active read current of 10 mA. It is housed in an SOP-8 package designed for surface mount technology. The device functions reliably across a temperature range of -40°C to +85°C.

Memory IC Feature Summary

  • Supports standard SPI and Quad I/O modes for high-speed data access
  • Operates at low voltage levels suitable for power-constrained systems
  • Provides non-volatile storage with fast read access times

Memory IC Applications

  • Firmware storage in embedded controllers
  • Code execution from memory (XIP) applications
  • Data logging in industrial monitoring devices

Memory IC Procurement Notes

Verify the specific suffix 'TIGR' against the manufacturer's official datasheet to confirm the SOP-8 package and tape-and-reel packaging configuration. Ensure that the 1.65V to 2V operating voltage aligns with your system's power rail requirements before integration. Confirm compliance with RoHS directives as specified in the product documentation.

Memory IC Selection Notes

Select this component when a 16 Mbit capacity is required with a narrow 1.65V to 2V supply window. The SOP-8 package offers a balance between pin count and board space. Compare against the GD25Q series if a higher 2.7V to 3.6V supply voltage is available, or consider the GD25LE16E3IGR for a WLCSP footprint alternative.

Memory IC Part Context

This part belongs to the GD25LE family of low-voltage SPI NOR flash memories. It shares architectural similarities with other GD25 variants but is distinguished by its specific voltage range and package type. The GD25LE16ETIGR serves as a specialized option for designs requiring lower power consumption during operation compared to standard 3.3V parts.

Memory IC Replacement Considerations

The GD25LE16E3IGR offers equivalent electrical specifications but utilizes an 8-WLCSP package instead of SOP-8. Designers must account for the physical footprint difference when substituting. Other GD25LE16 variants may differ in package style or thermal rating.

GD25LE16ETIGRGD25LE16ETIGR
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