GD25LE255ESIGR

Memory IC Overview

The GD25LE255ESIGR is a 256 Mbit NOR flash memory device manufactured by GigaDevice. It utilizes an SPI interface with support for Quad I/O and QPI modes, operating at a maximum clock frequency of 133 MHz. The component functions within a supply voltage range of 1.65 V to 2 V. It is housed in an 8-SOP surface-mount package and supports a commercial operating temperature range from -40°C to +85°C. The memory organization is specified as 32M x 8 bits.

Memory IC Feature Summary

• Supports high-speed serial peripheral interface (SPI) communication with Quad I/O and QPI mode capabilities for efficient data transfer.
• Provides non-volatile storage using SLC NAND technology architecture adapted for NOR flash execution.
• Operates on low voltage power supplies ranging from 1.65 V to 2 V suitable for portable applications.

Memory IC Applications

• Code storage in embedded systems requiring direct execution capability
• Data logging applications in consumer electronics
• Firmware storage in IoT devices

Memory IC Procurement Notes

Verify the current lifecycle status before procurement, as this part may be marked as Not Recommended for New Designs (NRND). Confirm availability through authorized distributors, noting that stock levels fluctuate. Ensure the 8-SOP package variant matches your PCB footprint requirements. Check for parameter-equivalent alternatives like the GD25LQ255ESIGR if supply constraints exist.

Memory IC Selection Notes

Select this component when a 256 Mbit capacity is required with a narrow 1.65 V to 2 V voltage window. The 8-SOP package offers a compact solution for space-constrained designs. Consider the 133 MHz speed limit for system timing constraints. Verify humidity sensitivity handling during assembly if the specific moisture sensitivity level requires baking or strict floor life management.

Memory IC Part Context

This device belongs to the GD25LE series of SPI NOR flash memories from GigaDevice. The series targets applications needing reliable code execution and data retention in small form factors. The 'E' suffix typically denotes specific process or feature variations within the LE family, while 'SIGR' indicates the SOP-8 package and tape-and-reel shipping configuration.

Memory IC Replacement Considerations

The GD25LQ255ESIGR is identified as a parameter-equivalent alternative. Verify pinout compatibility and electrical specifications before substitution. Other members of the GD25LE family with different capacities or packages may require schematic and layout modifications.