GD25LE255EWIGR

Memory IC Overview

The GD25LE255EWIGR is a 256M-bit (32M-Byte) Serial NOR Flash memory device manufactured by GigaDevice. It supports Standard, Dual, and Quad SPI interfaces with QPI mode capability. The device operates on a single power supply voltage ranging from 1.65V to 2.0V. It features a maximum clock frequency of 133MHz for fast read operations. Data transfer rates reach up to 266Mbits/s in Dual I/O mode and 532Mbits/s in Quad I/O mode. The memory organization consists of uniform 4K-Byte sectors and 32/64K-Byte blocks. It includes advanced security features such as hardware/software write protection and OTP lockable security registers.

Memory IC Feature Summary

• Supports Standard, Dual, Quad SPI, and QPI modes for flexible data transfer speeds
• Ultra-low power consumption with typical standby current of 11μA and deep power-down current of 0.2μA
• Advanced security architecture including software/hardware write protection and 128-bit Unique ID
• High endurance with minimum 100,000 Program/Erase cycles and 20-year data retention

Memory IC Applications

• Execute In Place (XiP) code storage for microcontrollers and SoCs
• Battery-powered IoT devices requiring extended operational life
• Wearable electronics and health monitoring systems
• Consumer electronics with compact form factor constraints

Memory IC Procurement Notes

Verify the specific suffix 'EWIGR' against the manufacturer's official ordering information table to confirm package type and tape/reel specifications. Confirm RoHS compliance status through the latest datasheet revision. Check component lifecycle status as distributors may list this part as Not Recommended for New Design (NRND). Ensure voltage requirements align with the 1.65V-2.0V range specified in the electrical characteristics section before procurement.

Memory IC Selection Notes

Select this component when system design requires ultra-low voltage operation between 1.65V and 2.0V. It is suitable for applications needing high-speed data access via Quad SPI or QPI modes. Consider this part for designs prioritizing low standby power consumption. Verify that the WSON8 package dimensions fit the PCB layout constraints. Ensure the host controller supports the required SPI command set and address modes.

Memory IC Part Context

The GD25LE255E series belongs to GigaDevice's ultra-low power SPI NOR Flash portfolio. It is designed specifically for battery-operated applications where power efficiency is critical. The series complements other GigaDevice flash products offering wider voltage ranges or higher densities. It targets markets such as wearables, IoT, and portable consumer electronics. The device integrates high-speed read capabilities to minimize instruction fetch latency in embedded systems.

Memory IC Replacement Considerations

GD25LQ255ESIGR is listed as a parameter equivalent alternative.