GD25LE32DLIGR

Description：IC FLASH 32MBIT SPI/QUAD 21WLCSP
Series：-
Mfr：GigaDevice Semiconductor (HK) Limited
Package：Tape & Reel (TR)

SKU:449a8beb0e2a Category: Memory IC Brand: GigaDevice Semiconductor (HK) Limited

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Product introduction

GD25LE32DLIGR is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 32MBIT SPI/QUAD 21WLCSP. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GD25LE32DLIGR

Description：IC FLASH 32MBIT SPI/QUAD 21WLCSP
Series：-
Mfr：GigaDevice Semiconductor (HK) Limited
Package：Tape & Reel (TR)
Memory Type：Non-Volatile
Memory Format：FLASH
Technology：FLASH - NOR
Memory Size：32Mbit
Memory Organization：4M x 8
Memory Interface：SPI - Quad I/O
Clock Frequency：120 MHz
Write Cycle Time - Word, Page：2.4ms
Voltage - Supply：1.65V ~ 2V
Operating Temperature：-40°C ~ 85°C (TA)
Mounting Type：Surface Mount
Package / Case：21-XFBGA, WLSCP
Supplier Device Package：21-WLCSP
Access Time：-
Grade：-
Qualification：-

Memory IC datasheet and documents for GD25LE32DLIGR

GD25LE32DLIGR

Memory IC Overview

The GD25LE32DLIGR is a 32 Mbit NOR flash memory device manufactured by GigaDevice. It operates within a supply voltage range of 1.65 V to 2 V and features an SPI interface with a maximum clock frequency of 120 MHz. The memory organization is specified as 4 M x 8 bits. The component is housed in an 8-ball WLCSP package and supports surface mount installation. It is rated for industrial temperature applications, functioning reliably between -40°C and +85°C. The active read current reaches a maximum of 25 mA.

Memory IC Feature Summary

Supports standard SPI and Quad I/O modes for data transfer
Provides uniform sector architecture for flexible storage management
Operates at low voltage levels suitable for power-constrained systems

Memory IC Applications

Industrial control systems requiring robust non-volatile storage
Consumer electronics utilizing low-power embedded memory
Automotive infotainment and instrument cluster modules

Memory IC Procurement Notes

Verify the specific revision level and manufacturing date code upon receipt to ensure compliance with project requirements. Confirm that the WLCSP-8 package dimensions align with the PCB footprint design. Check for moisture sensitivity labeling and adhere to recommended reflow profiles during assembly to prevent package damage or internal delamination.

Memory IC Selection Notes

Select this component when a compact form factor is required alongside low voltage operation. The WLCSP-8 package offers significant space savings compared to traditional SOP packages. Ensure the system design accommodates the 1.65 V to 2 V supply rail constraints and utilizes an SPI controller compatible with the 120 MHz clock speed specifications.

Memory IC Part Context

This part belongs to the GD25LE32D series of NOR flash memories from GigaDevice. The series is characterized by its focus on low voltage performance and small footprint solutions. It serves as a non-volatile storage solution for applications needing reliable code execution and data retention in industrial and consumer environments.