Memory IC GD25LE32ENIGR product image

GD25LE32ENIGR

$0.62
  • Description:IC FLASH 32MBIT SPI/QUAD 8USON
  • Series:GD25LE
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR)

SKU:f47bf1cd459c Category: Brand:

  
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GD25LE32ENIGR is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 32MBIT SPI/QUAD 8USON. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GD25LE32ENIGR

  • Description:IC FLASH 32MBIT SPI/QUAD 8USON
  • Series:GD25LE
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR)
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NOR (SLC)
  • Memory Size:32Mbit
  • Memory Organization:4M x 8
  • Memory Interface:SPI - Quad I/O, QPI
  • Clock Frequency:133 MHz
  • Write Cycle Time - Word, Page:60µs, 2.4ms
  • Voltage - Supply:1.65V ~ 2V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:8-UDFN Exposed Pad
  • Supplier Device Package:8-USON (3x4)
  • Access Time:6 ns
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for GD25LE32ENIGR

GD25LE32ENIGR

Memory IC Overview

The GD25LE32ENIGR is a 32M-bit Serial Flash memory device manufactured by GigaDevice. It supports Standard, Dual, and Quad SPI interfaces along with QPI mode. The device operates on a single power supply voltage ranging from 1.65V to 2.0V. It features a maximum clock frequency of 133MHz for fast read operations under a 30pF load. The memory organization consists of uniform sectors of 4K-Byte and blocks of 32K or 64K-Bytes. It utilizes an 8-lead USON package.

Memory IC Feature Summary

  • Supports standard, dual, quad SPI, and QPI modes for flexible data transfer rates.
  • Includes advanced security features such as hardware/software write protection and unique ID.
  • Enables Execute in Place (XiP) operation with continuous read capabilities.
  • Features low power consumption with typical standby current of 10μA.

Memory IC Applications

  • Code storage for embedded systems requiring high-speed access.
  • Data logging applications needing reliable non-volatile storage.
  • Firmware storage in consumer electronics devices.

Memory IC Procurement Notes

Verify the specific ordering suffix 'ENIGR' against the manufacturer's official documentation to confirm the exact package type and tape/reel specifications. Ensure compatibility with the required voltage range of 1.65V to 2.0V for your system design. Check for any regional compliance certifications required for your market.

Memory IC Selection Notes

Select this component when a 32M-bit capacity is required within a low-voltage 1.65V-2.0V operating range. It is suitable for designs prioritizing small form factor via the USON8 package. Consider alternative densities if higher storage is needed, or different voltage ranges if system power supplies differ significantly.

Memory IC Part Context

This part belongs to the GD25LE32E series of uniform sector dual and quad serial flash memories. The series is designed for applications requiring high performance and low power consumption. It shares architectural similarities with other members of the GD25LE family but differs in density and specific interface configurations.

Memory IC Replacement Considerations

Check for GD25LE32 variants with different package options if pin compatibility is not strictly required. Verify electrical characteristics match for direct replacement. Consult official substitution lists for guaranteed functional equivalence.

GD25LE32ENIGRGD25LE32ENIGR
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