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GD25LE64E3IGR is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 64MBIT SPI/QUAD 8WLCSP. Review the specifications below when checking this part for your BOM.
Memory IC specifications for GD25LE64E3IGR
- Description：IC FLASH 64MBIT SPI/QUAD 8WLCSP
- Series：GD25LE
- Mfr：GigaDevice Semiconductor (HK) Limited
- Package：Tape & Reel (TR)
- Memory Type：Non-Volatile
- Memory Format：FLASH
- Technology：FLASH - NOR (SLC)
- Memory Size：64Mbit
- Memory Organization：8M x 8
- Memory Interface：SPI - Quad I/O, QPI
- Clock Frequency：133 MHz
- Write Cycle Time - Word, Page：60µs, 2.4ms
- Voltage - Supply：1.65V ~ 2V
- Operating Temperature：-40°C ~ 85°C (TA)
- Mounting Type：Surface Mount
- Package / Case：8-XFBGA, WLCSP
- Supplier Device Package：8-WLCSP
- Access Time：6 ns
- Grade：-
- Qualification：-
Memory IC datasheet and documents for GD25LE64E3IGR
Memory IC Overview
The GD25LE64E3IGR is a 64 Mbit SPI NOR flash memory manufactured by GigaDevice. It operates within a supply voltage range of 1.65 V to 2 V and supports clock frequencies up to 133 MHz. The component utilizes an SPI interface for data communication. It is housed in a WLCSP-26 package designed for surface mount technology (SMD/SMT). The device functions reliably across an industrial temperature range from -40°C to +85°C.
Memory IC Feature Summary
- Supports high-speed serial peripheral interface operations with clock frequencies reaching 133 MHz
- Operates on low voltage power supplies ranging from 1.65 V to 2 V
- Utilizes wafer-level chip-scale packaging for compact surface-mount integration
Memory IC Applications
- Embedded code storage in consumer electronics
- Data retention in portable devices
- Firmware storage in IoT modules
Memory IC Procurement Notes
Verify the specific suffix against official manufacturer documentation to confirm pinout and electrical characteristics match design requirements. Confirm package type and operating voltage ranges align with system constraints before procurement. Ensure compatibility with existing PCB layout and soldering processes for the specified package style.
Memory IC Selection Notes
Select this component when a 64 Mbit capacity is required with a strict 2 V maximum voltage limit. The WLCSP-26 package is suitable for designs prioritizing minimal board space. Verify that the 133 MHz SPI speed meets system timing requirements and that the -40°C to +85°C temperature range covers operational environments.
Memory IC Part Context
This part belongs to the GD25LE series of SPI NOR flash memories from GigaDevice. The series targets applications requiring moderate density with low-voltage operation. Similar parts in the family may offer different capacities or package options while maintaining compatible interface protocols.
Memory IC Replacement Considerations
GD25LE64EQIGR offers identical electrical specifications but uses a USON-8 package instead of WLCSP-26.
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