Memory IC GD25LE64ELIGR product image

GD25LE64ELIGR

$0.77
  • Description:IC FLASH 64MBIT SPI/QUAD 16WLCSP
  • Series:GD25LE
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR)

SKU:a59c424d62de Category: Brand:

  
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GD25LE64ELIGR is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 64MBIT SPI/QUAD 16WLCSP. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GD25LE64ELIGR

  • Description:IC FLASH 64MBIT SPI/QUAD 16WLCSP
  • Series:GD25LE
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR)
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NOR (SLC)
  • Memory Size:64Mbit
  • Memory Organization:8M x 8
  • Memory Interface:SPI - Quad I/O, QPI
  • Clock Frequency:133 MHz
  • Write Cycle Time - Word, Page:60µs, 2.4ms
  • Voltage - Supply:1.65V ~ 2V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:16-XFBGA, WLCSP
  • Supplier Device Package:16-WLCSP
  • Access Time:6 ns
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for GD25LE64ELIGR

GD25LE64ELIGR

Memory IC Overview

The GD25LE64ELIGR is a 64M-bit Serial Flash memory device manufactured by GigaDevice. It supports standard, Dual, and Quad SPI interfaces as well as QPI mode. The device operates on a single power supply voltage ranging from 1.65V to 2.0V. It features a uniform sector architecture with 4K-byte sectors and 32/64K-byte blocks. The maximum clock frequency for fast read operations is 133MHz. Data retention is typically 20 years, with endurance of at least 100,000 program/erase cycles.

Memory IC Feature Summary

  • Supports Standard, Dual, Quad SPI, and QPI modes for flexible data transfer rates.
  • Includes advanced security features such as 128-bit Unique ID and hardware/software write protection.
  • Features low power consumption with typical standby current of 10μA and deep power-down current of 0.2μA.
  • Allows Execute In Place (XiP) operation with continuous read capabilities to reduce latency.

Memory IC Applications

  • Embedded systems requiring non-volatile code storage
  • IoT devices needing secure boot and firmware updates
  • Consumer electronics with limited power budgets

Memory IC Procurement Notes

Verify the specific package variant (WLCSP, USON8, or SOP8) matches the design requirements, as the 'IGR' suffix indicates specific packaging and tape/reel configuration. Confirm voltage range compatibility with the system's power supply rails. Ensure ESD handling procedures are followed during assembly due to the small form factor options available for this component.

Memory IC Selection Notes

Select this part when a 64M-bit density is required with low voltage operation between 1.65V and 2.0V. It is suitable for designs needing high-speed Quad I/O or QPI interfaces. Consider the available package types like WLCSP or USON8 for space-constrained applications. Verify that the required security features, such as OTP locks and unique IDs, align with the project's security strategy.

Memory IC Part Context

The GD25LE64E series is part of GigaDevice's SPI NOR Flash portfolio designed for cost-effective and high-performance storage solutions. The GD25LE64ELIGR specifically denotes a version within this family, likely differing in package type or manufacturing revision compared to other suffixes like EQIGR or LIGR. It shares core electrical and functional specifications with the broader GD25LE64E family.

Memory IC Replacement Considerations

GD25LE64EQIGR: Similar specifications but may differ in package type (USON-8 vs WLCSP). GD25LE64LIGR: Check datasheet for any pinout or feature variations. Always verify electrical characteristics and package dimensions before substitution.

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