Memory IC GD25LE64EQIGR product image

GD25LE64EQIGR

$0.77
  • Description:IC FLASH 64MBIT SPI/QUAD 8USON
  • Series:GD25LE
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR)

SKU:1567ca72f7c9 Category: Brand:

  
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GD25LE64EQIGR is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 64MBIT SPI/QUAD 8USON. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GD25LE64EQIGR

  • Description:IC FLASH 64MBIT SPI/QUAD 8USON
  • Series:GD25LE
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR)
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NOR (SLC)
  • Memory Size:64Mbit
  • Memory Organization:8M x 8
  • Memory Interface:SPI - Quad I/O, QPI
  • Clock Frequency:133 MHz
  • Write Cycle Time - Word, Page:60µs, 2.4ms
  • Voltage - Supply:1.65V ~ 2V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:8-XDFN Exposed Pad
  • Supplier Device Package:8-USON (4x4)
  • Access Time:6 ns
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for GD25LE64EQIGR

GD25LE64EQIGR

Memory IC Overview

The GD25LE64EQIGR is a 64 Mbit NOR flash memory device manufactured by GigaDevice. It utilizes a USON-8 surface-mount package and operates within a supply voltage range of 1.65 V to 2 V. The component supports SPI interface communication with a maximum clock frequency of 133 MHz. It is designed for industrial temperature environments, functioning reliably between -40°C and +85°C.

Memory IC Feature Summary

  • Supports standard Serial Peripheral Interface (SPI) protocol for data transfer.
  • Provides non-volatile storage capability for persistent data retention.
  • Engineered for low-voltage operation suitable for portable applications.

Memory IC Applications

  • Embedded systems requiring code execution from flash memory
  • Industrial control devices operating in wide temperature ranges
  • Consumer electronics utilizing low-power memory solutions

Memory IC Procurement Notes

Verify the specific suffix 'QI' against the manufacturer's official datasheet to confirm package type and material specifications. Ensure the ordering quantity aligns with the factory reel packaging requirements. Confirm that the intended application environment remains within the specified electrical and thermal limits defined in the product documentation.

Memory IC Selection Notes

Select this component when a compact USON-8 footprint is required alongside low-voltage compatibility. The 133 MHz speed rating supports efficient code execution. Compare against other GD25LE series variants if different package styles or voltage tolerances are needed for the specific design constraints.

Memory IC Part Context

This part belongs to the GD25LE series of SPI NOR flash memories. The series is characterized by high performance and security features. It serves as a memory solution for diverse design requirements across various electronic applications, offering reliable data storage in a small form factor.

Memory IC Replacement Considerations

GD25LE64E3IGR offers identical electrical specifications but uses a WLCSP-26 package instead of USON-8. Other GD25LE64 variants may share functional parameters but differ in physical dimensions or pin configurations.

GD25LE64EQIGRGD25LE64EQIGR
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