Memory IC GD25LE64ESIGY product image

GD25LE64ESIGY

$0.68
  • Description:IC FLASH 64MBIT SPI/QUAD 8SOP
  • Series:GD25LE
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tray

SKU:0ef2651ab63e Category: Brand:

  
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GD25LE64ESIGY is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 64MBIT SPI/QUAD 8SOP. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GD25LE64ESIGY

  • Description:IC FLASH 64MBIT SPI/QUAD 8SOP
  • Series:GD25LE
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tray
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NOR (SLC)
  • Memory Size:64Mbit
  • Memory Organization:8M x 8
  • Memory Interface:SPI - Quad I/O, QPI
  • Clock Frequency:133 MHz
  • Write Cycle Time - Word, Page:60µs, 2.4ms
  • Voltage - Supply:1.65V ~ 2V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:8-SOIC (0.209", 5.30mm Width)
  • Supplier Device Package:8-SOP
  • Access Time:6 ns
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for GD25LE64ESIGY

GD25LE64ESIGY

Memory IC Overview

The GD25LE64ESIGY is a 64 Mbit NOR flash memory device manufactured by GigaDevice. It utilizes a Serial Peripheral Interface (SPI) for data communication and operates within a supply voltage range of 1.65 V to 2 V. The component supports maximum clock frequencies up to 133 MHz, ensuring efficient data transfer rates. Designed for surface-mount technology, it is housed in an SOP-8 package. The device functions reliably across an industrial temperature range from -40°C to +85°C.

Memory IC Feature Summary

  • Supports low-voltage operation with a minimum supply requirement of 1.65 V
  • Features SPI interface compatibility for standard serial communication protocols
  • Provides high-speed data access with support for clock frequencies up to 133 MHz

Memory IC Applications

  • Embedded systems requiring low-power code storage
  • Consumer electronics with strict voltage constraints
  • Industrial control units operating in moderate temperature environments

Memory IC Procurement Notes

Verify the specific suffix 'GY' against the official manufacturer datasheet to confirm package type and tape-and-reel specifications. Ensure the design accommodates the 1.65 V to 2 V operating window, as this differs from standard 3V parts. Confirm availability through authorized distributors, noting that factory packaging quantities may apply. Cross-reference the exact part number to avoid confusion with similar density variants.

Memory IC Selection Notes

Select this component when system power budgets require operation below 2 V. The 64 Mbit capacity suits applications needing moderate code storage without high-density requirements. Verify that the host controller supports the required SPI modes and clock speeds. Consider the SOP-8 footprint during PCB layout planning. Ensure thermal management aligns with the specified -40°C to +85°C operational range for the intended environment.

Memory IC Part Context

This part belongs to the GD25LE series of SPI NOR flash memories from GigaDevice. The series targets applications demanding low voltage operation and reliable non-volatile storage. It complements higher voltage variants like the GD25Q series, offering a specialized solution for ultra-low power designs. The product line emphasizes scalability and integration into compact electronic devices.

Memory IC Replacement Considerations

Check for GD25LE64ESIGR if reel packaging is preferred over trays. Verify electrical compatibility with GD25LQ64 variants, noting potential differences in supported I/O modes such as Dual or Quad SPI. Ensure any substitute maintains the same 1.65 V to 2 V voltage range and SOP-8 package dimensions.

GD25LE64ESIGYGD25LE64ESIGY
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