Memory IC GD25LE64EWIGR product image

GD25LE64EWIGR

$0.77
  • Description:IC FLASH 64MBIT SPI/QUAD 8WSON
  • Series:GD25LE
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR)

SKU:4ad221051a03 Category: Brand:

  
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GD25LE64EWIGR is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 64MBIT SPI/QUAD 8WSON. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GD25LE64EWIGR

  • Description:IC FLASH 64MBIT SPI/QUAD 8WSON
  • Series:GD25LE
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR)
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NOR (SLC)
  • Memory Size:64Mbit
  • Memory Organization:8M x 8
  • Memory Interface:SPI - Quad I/O, QPI
  • Clock Frequency:133 MHz
  • Write Cycle Time - Word, Page:60µs, 2.4ms
  • Voltage - Supply:1.65V ~ 2V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:8-WDFN Exposed Pad
  • Supplier Device Package:8-WSON (5x6)
  • Access Time:6 ns
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for GD25LE64EWIGR

GD25LE64EWIGR

Memory IC Overview

The GD25LE64EWIGR is a 64 Mbit NOR flash memory device manufactured by GigaDevice. It utilizes a single power supply ranging from 1.65 V to 2 V and communicates via a standard SPI interface with a maximum clock frequency of 133 MHz. The component is housed in an USON-8 package, designed for surface mount installation. It operates within a temperature range of -40°C to +85°C and supports Execute-In-Place (XiP) operations for efficient code execution directly from the memory.

Memory IC Feature Summary

  • Supports high-speed serial peripheral interface communication for rapid data access
  • Enables execute-in-place functionality to reduce overall fetch times
  • Operates on a single low-voltage power supply for energy efficiency

Memory IC Applications

  • Embedded systems requiring non-volatile code storage
  • Consumer electronics with limited power budgets
  • Industrial control units needing reliable firmware retention

Memory IC Procurement Notes

Verify the specific suffix 'EWI' against official datasheets to confirm package dimensions and tape-and-reel specifications. Ensure voltage requirements align with system design constraints. Confirm moisture sensitivity levels and reflow soldering profiles prior to assembly. Cross-reference ordering information with authorized distributors to avoid counterfeit components.

Memory IC Selection Notes

Select this component when a compact USON-8 footprint is required alongside low-voltage operation. Compare performance metrics against similar capacity devices if higher voltage tolerance or alternative pinouts are necessary. Evaluate thermal management needs given the small package size and operating temperature range.

Memory IC Part Context

This part belongs to the GD25LE series of NOR flash memories, which are optimized for low-power applications. The series typically offers high reliability and endurance suitable for frequent write cycles. It serves as a cost-effective solution for storing boot code and configuration data in portable devices.

Memory IC Replacement Considerations

Check for GD25LE64ENIGR or GD25LE64EQIGR as potential alternatives within the same family. Verify pin compatibility and electrical characteristics before substitution.

GD25LE64EWIGRGD25LE64EWIGR
$0.77
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