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GD25LE64EXEEGR is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 64MBIT SPI/QUAD 8USON. Review the specifications below when checking this part for your BOM.
Memory IC specifications for GD25LE64EXEEGR
- Description：IC FLASH 64MBIT SPI/QUAD 8USON
- Series：GD25LE
- Mfr：GigaDevice Semiconductor (HK) Limited
- Package：Tape & Reel (TR)
- Memory Type：Non-Volatile
- Memory Format：FLASH
- Technology：FLASH - NOR (SLC)
- Memory Size：64Mbit
- Memory Organization：8M x 8
- Memory Interface：SPI - Quad I/O, QPI
- Clock Frequency：133 MHz
- Write Cycle Time - Word, Page：100µs, 4ms
- Voltage - Supply：1.65V ~ 2V
- Operating Temperature：-40°C ~ 125°C (TA)
- Mounting Type：Surface Mount
- Package / Case：8-XFDFN Exposed Pad
- Supplier Device Package：8-FO-USON (3x2)
- Access Time：6 ns
- Grade：-
- Qualification：-
Memory IC datasheet and documents for GD25LE64EXEEGR
Memory IC Overview
The GD25LE64EXEEGR is a 64 Mbit SPI NOR flash memory IC manufactured by GigaDevice. It supports Single, Dual, Quad I/O, and QPI interfaces with a maximum clock frequency of 133 MHz. The device operates within a voltage range of 1.65 V to 2.0 V and features an 8-FO-USON (3x2) package. It includes hardware reset functionality, security registers with OTP locks, and unique ID capabilities.
Memory IC Feature Summary
- Supports high-speed SPI communication modes including Quad I/O and QPI for efficient data transfer.
- Integrates hardware reset functionality to enhance system reliability during operation.
- Includes security registers with One-Time Programmable (OTP) locks for data protection.
Memory IC Applications
- Industrial control systems
- Consumer electronics devices
- Internet of Things (IoT) applications
Memory IC Procurement Notes
Verify the specific suffix EEGR against official datasheets to confirm package type and tape/reel specifications. Ensure compatibility with 1.65V to 2.0V supply rails in the target design. Confirm lead times as manufacturing cycles may vary. Validate that the 8-FO-USON footprint matches the PCB layout requirements before finalizing procurement orders.
Memory IC Selection Notes
Select this component when low voltage operation between 1.65V and 2.0V is required. It is suitable for designs needing 64 Mbit density with Quad I/O support. Consider the 8-FO-USON package size for space-constrained layouts. Verify interface speed requirements align with the 133 MHz maximum clock frequency specification.
Memory IC Part Context
This part belongs to the GD25LE series of SPI NOR flash memories from GigaDevice. The series is characterized by ultra-low voltage operation and high performance. It complements other non-volatile storage solutions like the GD25UF and GD25Q series, targeting applications requiring energy efficiency and compact form factors.
Memory IC Replacement Considerations
Check for GD25LE64ELIGR or similar variants within the same family. Verify pinout and electrical characteristics match exactly. Ensure the replacement supports the same 1.65V-2.0V operating range and USON-8 package dimensions.
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