Memory IC GD25LF128EXHEGR product image

GD25LF128EXHEGR

$1.19
  • Description:IC FLASH 128MBIT SPI/QUAD 8USON
  • Series:GD25LF
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR)

SKU:4c20e1ab3bd2 Category: Brand:

  
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GD25LF128EXHEGR is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 128MBIT SPI/QUAD 8USON. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GD25LF128EXHEGR

  • Description:IC FLASH 128MBIT SPI/QUAD 8USON
  • Series:GD25LF
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR)
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NOR (SLC)
  • Memory Size:128Mbit
  • Memory Organization:16M x 8
  • Memory Interface:SPI - Quad I/O, QPI, DTR
  • Clock Frequency:133 MHz
  • Write Cycle Time - Word, Page:100µs, 4ms
  • Voltage - Supply:1.65V ~ 2V
  • Operating Temperature:-40°C ~ 125°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:8-XDFN Exposed Pad
  • Supplier Device Package:8-FO-USON8 (3x3)
  • Access Time:5.5 ns
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for GD25LF128EXHEGR

GD25LF128EXHEGR

Memory IC Overview

The GD25LF128EXHEGR is a 128 Mbit NOR flash memory component manufactured by GigaDevice. It features a storage organization of 16 M x 8 bits and supports DTR, Dual, Quad SPI, QPI, and standard SPI interfaces. The device operates within a supply voltage range of 1.65 V to 2 V and achieves a maximum clock frequency of 166 MHz. It is designed for surface mount installation in an 8-FO-USON package with dimensions of 3x3 mm. The operational temperature range spans from -40°C to +125°C, ensuring reliability across industrial conditions.

Memory IC Feature Summary

  • Supports high-speed data transfer via DTR, Dual, Quad SPI, and QPI interface modes.
  • Operates at a maximum clock frequency of 166 MHz for efficient code execution.
  • Provides extended thermal stability suitable for demanding industrial environments.

Memory IC Applications

  • Industrial control systems requiring robust non-volatile storage
  • Automotive embedded applications needing wide temperature tolerance
  • Consumer electronics utilizing low-voltage power supplies

Memory IC Procurement Notes

Verify the specific suffix HEGR against official datasheets to confirm the exact package type and tape-and-reel specifications. Ensure compatibility with the target system's voltage levels, as this component requires a 1.65 V to 2 V supply. Confirm that the design accommodates the 8-FO-USON footprint and thermal requirements for operation up to 125°C.

Memory IC Selection Notes

Select this part when a 128 Mbit capacity is required alongside support for advanced multi-I/O protocols like QPI and DTR. It is appropriate for designs constrained by low voltage rails between 1.65 V and 2 V. Consider the 8-FO-USON package size if board space is limited compared to standard SOP or WSON options.

Memory IC Part Context

This component belongs to the GD25LF series of SPI NOR flash memories from GigaDevice. The series is characterized by its support for low-voltage operations and high-speed interface capabilities. It serves as a non-volatile storage solution for executing code directly from memory (XIP) in various electronic devices.

Memory IC Replacement Considerations

GD25LE128EXHEGR is listed as a parameter-equivalent alternative.

GD25LF128EXHEGRGD25LF128EXHEGR
$1.19
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