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GD25LQ128DBAGY is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLSH 128MBIT SPI/QUAD 24TFBGA. Review the specifications below when checking this part for your BOM.
Memory IC specifications for GD25LQ128DBAGY
- Description：IC FLSH 128MBIT SPI/QUAD 24TFBGA
- Series：GD25LQ
- Mfr：GigaDevice Semiconductor (HK) Limited
- Package：Tray
- Memory Type：Non-Volatile
- Memory Format：FLASH
- Technology：FLASH - NOR (SLC)
- Memory Size：128Mbit
- Memory Organization：16M x 8
- Memory Interface：SPI - Quad I/O, QPI
- Clock Frequency：104 MHz
- Write Cycle Time - Word, Page：4ms
- Voltage - Supply：1.65V ~ 2V
- Operating Temperature：-40°C ~ 125°C (TA)
- Mounting Type：Surface Mount
- Package / Case：24-TBGA
- Supplier Device Package：24-TFBGA (6x8)
- Access Time：6 ns
- Grade：-
- Qualification：-
Memory IC datasheet and documents for GD25LQ128DBAGY
Memory IC Overview
The GD25LQ128DBAGY is a 128Mb (16M x 8) SPI NOR Flash memory IC manufactured by GigaDevice. It supports Quad I/O interface with a clock frequency of 120 MHz and operates within a supply voltage range of 1.65V to 2V. The device features an 8-WSON package with dimensions of 5x6mm. It has a page write time of 2.4ms and functions within a temperature range of -40°C to 85°C.
Memory IC Feature Summary
- Supports high-speed Quad I/O SPI interface for efficient data transfer
- Operates at low voltage levels suitable for power-sensitive designs
- Provides non-volatile storage with uniform sector architecture
Memory IC Applications
- Embedded systems requiring code storage
- Consumer electronics devices
- Industrial control applications
Memory IC Procurement Notes
Verify the specific suffix 'BAGY' against official datasheets to confirm package type and tape/reel specifications. Check component status as some variants may be marked not recommended for new designs. Confirm RoHS compliance and moisture sensitivity level requirements for your assembly process.
Memory IC Selection Notes
Select this part when a 128Mb capacity with Quad SPI support is required in a compact 8-WSON footprint. Ensure the system design accommodates the 1.65V-2V operating voltage range. Consider the 120 MHz clock speed for performance needs and verify thermal constraints for the specified operating temperature range.
Memory IC Part Context
This component belongs to the GD25LQ series of SPI NOR Flash memories from GigaDevice. The series offers various densities and packages, targeting applications needing reliable non-volatile storage with low power consumption. The GD25LQ128 variant specifically provides 128Mb capacity in multiple package options including WSON and SOP.
Memory IC Replacement Considerations
Check for direct pin-compatible substitutes within the GD25LQ family such as GD25LQ128DWIGR or GD25LQ128DSIGR, ensuring identical voltage and package specifications. Verify that any replacement maintains the same 120 MHz clock speed and 128Mb density.
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