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GD25LQ128DY2GY is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 128MBIT SPI/QUAD 8WSON. Review the specifications below when checking this part for your BOM.
Memory IC specifications for GD25LQ128DY2GY
- Description：IC FLASH 128MBIT SPI/QUAD 8WSON
- Series：GD25LQ
- Mfr：GigaDevice Semiconductor (HK) Limited
- Package：Tray
- Memory Type：Non-Volatile
- Memory Format：FLASH
- Technology：FLASH - NOR (SLC)
- Memory Size：128Mbit
- Memory Organization：16M x 8
- Memory Interface：SPI - Quad I/O, QPI
- Clock Frequency：104 MHz
- Write Cycle Time - Word, Page：2.4ms
- Voltage - Supply：1.65V ~ 2V
- Operating Temperature：-40°C ~ 105°C (TA)
- Mounting Type：Surface Mount
- Package / Case：8-WDFN Exposed Pad
- Supplier Device Package：8-WSON (6x8)
- Access Time：6 ns
- Grade：-
- Qualification：-
Memory IC datasheet and documents for GD25LQ128DY2GY
Memory IC Overview
The GD25LQ128DY2GY is a 128Mbit SPI NOR Flash memory IC manufactured by GigaDevice Semiconductor. It features an 8-WSON package and supports Quad I/O SPI interfaces with a maximum clock frequency of 120 MHz. The device operates within a supply voltage range of 1.65V to 2V and is rated for industrial temperatures from -40°C to +85°C. Memory organization is 16M x 8 bits, providing non-volatile storage suitable for firmware and configuration data.
Memory IC Feature Summary
- Supports high-speed Quad I/O SPI interface for efficient data transfer
- Provides uniform sector architecture for reliable code execution
- Operates at low voltage levels for power efficiency in embedded systems
Memory IC Applications
- Storing firmware in embedded systems
- Configuration data storage
- Boot code storage
Memory IC Procurement Notes
Verify the specific suffix 'DY2GY' against official manufacturer documentation to confirm package type and temperature grade. Ensure compatibility with existing board layouts regarding the 8-WSON footprint. Confirm RoHS compliance status through current datasheets before integration into production designs.
Memory IC Selection Notes
Select this component when a compact 8-WSON package is required for 128Mbit storage. It is appropriate for applications needing 1.8V operation and industrial temperature ranges. Compare performance metrics such as access time and write cycle duration against alternative packages like SOP-8 if space constraints are flexible.
Memory IC Part Context
This part belongs to the GD25LQ128D series of SPI NOR Flash memories. The series offers various packaging options including SOP-8 and WSON variants. These devices are designed for general-purpose non-volatile storage in consumer electronics and IoT applications requiring small form factors.
Memory IC Replacement Considerations
Check for direct substitutes within the GD25LQ128 family that share the same electrical specifications but differ only in packaging or tape-and-reel configurations. Verify pinout compatibility before substitution.
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