Memory IC GD25LQ128EQEGR product image

GD25LQ128EQEGR

$1.50
  • Description:IC FLASH 128MBIT SPI/QUAD 8USON
  • Series:GD25LQ
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR)

SKU:f68a6e0c183b Category: Brand:

  
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GD25LQ128EQEGR is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 128MBIT SPI/QUAD 8USON. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GD25LQ128EQEGR

  • Description:IC FLASH 128MBIT SPI/QUAD 8USON
  • Series:GD25LQ
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR)
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NOR (SLC)
  • Memory Size:128Mbit
  • Memory Organization:16M x 8
  • Memory Interface:SPI - Quad I/O
  • Clock Frequency:120 MHz
  • Write Cycle Time - Word, Page:100µs, 4ms
  • Voltage - Supply:1.65V ~ 2V
  • Operating Temperature:-40°C ~ 125°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:8-XDFN Exposed Pad
  • Supplier Device Package:8-USON (4x4)
  • Access Time:6 ns
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for GD25LQ128EQEGR

GD25LQ128EQEGR

Memory IC Overview

The GD25LQ128EQEGR is a non-volatile NOR flash memory IC manufactured by GigaDevice. It offers a storage capacity of 128Mb organized as 16M x 8 bits. The device supports SPI and Quad I/O interfaces with a maximum clock frequency of 120 MHz and an access time of 6 ns. It operates within a supply voltage range of 1.65V to 2V. The component is housed in an 8-USON (4x4) package with exposed pad, suitable for surface mount installation. It functions reliably across an operating temperature range of -40°C to 85°C.

Memory IC Feature Summary

  • Supports high-speed serial peripheral interface with quad input/output capabilities for efficient data transfer.
  • Features low-voltage operation optimized for power-sensitive embedded applications.
  • Provides uniform sector architecture for flexible code and data storage management.

Memory IC Applications

  • Consumer electronics firmware storage
  • Industrial control system programming
  • IoT device code retention

Memory IC Procurement Notes

Verify the specific suffix 'EQEGR' against the manufacturer's latest datasheet to confirm the exact package type and tape-and-reel specifications. Ensure compatibility with the target board's thermal dissipation requirements for the USON package. Confirm RoHS compliance status if required by regional regulations before finalizing procurement orders.

Memory IC Selection Notes

Select this component when a compact 8-pin footprint is required alongside 128Mb capacity. The 1.8V voltage domain makes it suitable for modern low-power systems. Compare access times and package dimensions against alternatives like the ESIGR variant if SOP packaging is preferred over USON for assembly constraints.

Memory IC Part Context

This part belongs to the GD25LQ series of 1.8V SPI NOR flash memories from GigaDevice. The series is designed for applications requiring high performance and security features. The EQEGR designation specifically indicates the 8-USON package configuration, distinguishing it from other pinout options in the same memory density family.

Memory IC Replacement Considerations

GD25LQ128ESIGR: Offers identical electrical specifications but utilizes an 8-SOP package instead of USON. Verify mechanical fitment on the PCB before substitution.

GD25LQ128EQEGRGD25LQ128EQEGR
$1.50
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