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GD25LQ128EQIGR is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 128MBIT SPI/QUAD 8USON. Review the specifications below when checking this part for your BOM.
Memory IC specifications for GD25LQ128EQIGR
- Description：IC FLASH 128MBIT SPI/QUAD 8USON
- Series：GD25LQ
- Mfr：GigaDevice Semiconductor (HK) Limited
- Package：Tape & Reel (TR)
- Memory Type：Non-Volatile
- Memory Format：FLASH
- Technology：FLASH - NOR (SLC)
- Memory Size：128Mbit
- Memory Organization：16M x 8
- Memory Interface：SPI - Quad I/O
- Clock Frequency：120 MHz
- Write Cycle Time - Word, Page：60µs, 2.4ms
- Voltage - Supply：1.65V ~ 2V
- Operating Temperature：-40°C ~ 85°C (TA)
- Mounting Type：Surface Mount
- Package / Case：8-XDFN Exposed Pad
- Supplier Device Package：8-USON (4x4)
- Access Time：6 ns
- Grade：-
- Qualification：-
Memory IC datasheet and documents for GD25LQ128EQIGR
Memory IC Overview
The GD25LQ128EQIGR is a 128 Mbit NOR flash memory device manufactured by GigaDevice. It utilizes an SPI interface with Quad I/O support and operates at a maximum clock frequency of 120 MHz. The storage organization is 16 M x 8 bits. Electrical specifications include a supply voltage range of 1.65 V to 2 V, with a maximum active read current of 20 mA. The component supports surface mount installation in an 8-USON (4x4) package. Operating temperature ranges from -40°C to +85°C.
Memory IC Feature Summary
- Supports uniform sector architecture for flexible data management
- Enables high-speed data transfer via SPI Quad I/O mode
- Operates within low voltage power supply requirements
Memory IC Applications
- Embedded systems requiring code execution
- Consumer electronics firmware storage
- Industrial control applications
Memory IC Procurement Notes
Verify the specific package designation matches the required footprint, as suffixes indicate physical form factors. Confirm voltage and temperature ratings align with target system constraints. Check manufacturer documentation for lead times and availability status prior to ordering. Ensure compliance with RoHS directives if applicable to the project requirements.
Memory IC Selection Notes
Select this component when a compact USON package is necessary for space-constrained designs. The 120 MHz speed suits applications needing moderate performance without higher power consumption. Verify that the 1.65V to 2V operating range fits the system power rails. Consider the 128 Mbit capacity against total storage needs.
Memory IC Part Context
This part belongs to the GD25LQ series of SPI NOR flash memories from GigaDevice. The series offers various densities and packages tailored for embedded storage. The 'E' suffix typically denotes specific package or material variations within the product line. This family targets cost-sensitive and size-restricted electronic devices.
Memory IC Replacement Considerations
Cross-reference pinouts and electrical characteristics carefully. Verify compatibility with existing firmware before substitution.
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