Memory IC GD25LQ16CWIGR product image

GD25LQ16CWIGR

  • Description:IC FLASH 16MBIT SPI/QUAD 8WSON
  • Series:-
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR)

SKU:214bc5785152 Category: Brand:

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GD25LQ16CWIGR is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 16MBIT SPI/QUAD 8WSON. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GD25LQ16CWIGR

  • Description:IC FLASH 16MBIT SPI/QUAD 8WSON
  • Series:-
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR)
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NOR
  • Memory Size:16Mbit
  • Memory Organization:2M x 8
  • Memory Interface:SPI - Quad I/O
  • Clock Frequency:104 MHz
  • Write Cycle Time - Word, Page:50µs, 2.4ms
  • Voltage - Supply:1.65V ~ 2.1V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:8-WDFN Exposed Pad
  • Supplier Device Package:8-WSON (5x6)
  • Access Time:-
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for GD25LQ16CWIGR

GD25LQ16CWIGR

Memory IC Overview

The GD25LQ16CWIGR is a 16M-bit (2M x 8) Serial NOR Flash memory manufactured by GigaDevice. It operates on a single power supply voltage ranging from 1.65V to 2.1V and supports Standard, Dual, and Quad SPI interfaces with a maximum clock frequency of 104MHz. The device features uniform sector architecture with 4K-byte sectors and 32/64K-byte blocks. It includes advanced security features such as hardware/software write protection, 128-bit unique ID, and OTP lockable security registers. The component is designed for industrial temperature ranges (-40°C to +85°C) and offers high endurance with minimum 100,000 program/erase cycles.

Memory IC Feature Summary

  • Supports Standard, Dual, and Quad SPI interfaces for flexible data transfer speeds up to 416Mbits/s in Quad I/O mode.
  • Provides comprehensive data protection via software block protect bits and hardware WP# pin control.
  • Features low power consumption with typical standby current of 9uA and deep power-down current of 1uA.
  • Includes 128-bit Unique ID and three 512-byte security registers with One-Time Programmable (OTP) lock capability.

Memory IC Applications

  • Embedded systems requiring code storage and execution in place (XIP).
  • Consumer electronics and IoT devices needing compact form factors and low power operation.
  • Industrial applications operating within the specified industrial temperature range.
  • Firmware storage for microcontrollers and system-on-chips (SoCs).

Memory IC Procurement Notes

Verify the specific package variant (WIGR suffix indicates WSON8 6x5mm) against your PCB footprint requirements. Confirm that the 1.65V-2.1V supply voltage aligns with your system design, as this part is not compatible with standard 3.3V-only designs without level shifting or voltage regulation. Check for end-of-life status or alternative recommendations from the manufacturer before finalizing procurement.

Memory IC Selection Notes

Select this component when a 16M-bit density is required with strict low-voltage operation constraints between 1.65V and 2.1V. It is suitable for designs needing Quad SPI performance for faster read speeds compared to standard SPI parts. Ensure the application can accommodate the WSON8 package dimensions and that the industrial temperature range meets environmental specifications. Compare with GD25Q series if 3.3V operation is preferred instead.

Memory IC Part Context

The GD25LQ16C belongs to GigaDevice's 1.8V Uniform Sector Dual and Quad Serial Flash family. This series is optimized for low-power applications and modern SoCs that operate at lower voltages. The 'L' designation typically denotes the 1.8V (1.65V-2.1V) voltage range, distinguishing it from the 'Q' series which supports wider voltage ranges like 2.7V-3.6V. The product line emphasizes reliability and security features for embedded storage needs.

Memory IC Replacement Considerations

GD25LQ16CTIGR: Same electrical specifications but in SOP8 package. GD25LQ16CNIGR: Same electrical specifications but in USON8 package. Verify pin compatibility and thermal characteristics when substituting packages.

GD25LQ16CWIGRGD25LQ16CWIGR

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