Memory IC GD25LQ16ENEGR product image

GD25LQ16ENEGR

$0.65
  • Description:IC FLASH 16MBIT SPI/QUAD 8USON
  • Series:GD25LQ
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR)

SKU:a2e0b6fa87a3 Category: Brand:

  
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GD25LQ16ENEGR is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 16MBIT SPI/QUAD 8USON. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GD25LQ16ENEGR

  • Description:IC FLASH 16MBIT SPI/QUAD 8USON
  • Series:GD25LQ
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR)
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NOR (SLC)
  • Memory Size:16Mbit
  • Memory Organization:2M x 8
  • Memory Interface:SPI - Quad I/O, QPI
  • Clock Frequency:133 MHz
  • Write Cycle Time - Word, Page:100µs, 4ms
  • Voltage - Supply:1.65V ~ 2.1V
  • Operating Temperature:-40°C ~ 125°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:8-UDFN Exposed Pad
  • Supplier Device Package:8-USON (3x4)
  • Access Time:6 ns
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for GD25LQ16ENEGR

GD25LQ16ENEGR

Memory IC Overview

The GD25LQ16ENEGR is a 16 Mbit NOR flash memory device manufactured by GigaDevice. It features an SPI interface with a maximum clock frequency of 133 MHz and supports read speeds up to 133 MHz. The storage capacity is organized as 2 M x 8 bits with an 8-bit data bus width. Operating voltage ranges from 1.65 V to 2.1 V, with a maximum active read current of 15 mA. The component operates within a temperature range of -40°C to +85°C and is housed in an USON-8 surface-mount package.

Memory IC Feature Summary

  • Supports high-speed serial peripheral interface (SPI) communication for efficient data transfer.
  • Provides non-volatile storage capability suitable for code execution applications.
  • Designed for low-power operation with specified active read current limits.

Memory IC Applications

  • Embedded systems requiring compact non-volatile code storage
  • Industrial control devices operating in extended temperature environments
  • Consumer electronics utilizing small form-factor surface-mount packages

Memory IC Procurement Notes

Verify the exact suffix 'ENIGR' against official manufacturer documentation to confirm pinout compatibility and specific packaging variations. Ensure that the 1.65V to 2.1V supply voltage requirements align with the target system design. Confirm moisture sensitivity level handling procedures during assembly to prevent damage. Cross-reference the datasheet revision date to ensure all electrical characteristics match the intended application specifications.

Memory IC Selection Notes

Select this component when a 16 Mbit capacity is required in an USON-8 package. The 133 MHz clock speed supports fast boot times for embedded applications. Verify that the 1.65V minimum voltage meets the system power rail constraints. Consider the -40°C to +85°C operating range for environmental suitability. Compare against other GD25LQ series variants if different package types or voltage ranges are needed.

Memory IC Part Context

This part belongs to the GD25LQ series of NOR flash memories from GigaDevice. The series offers various capacities and package options including USON, WSON, and SOP formats. These devices are designed for general-purpose storage and code execution in embedded systems. The LQ designation typically indicates specific performance and voltage characteristics within the broader product line.

Memory IC Replacement Considerations

GD25LQ16EWIGR is listed as a parameter-equivalent alternative with similar specifications but in a WSON-8 package. Verify pin-to-pin compatibility and package dimensions before substitution. Other GD25LQ16 variants may differ in voltage range or package type.

GD25LQ16ENEGRGD25LQ16ENEGR
$0.65
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