Memory IC GD25LQ16ESEGR product image

GD25LQ16ESEGR

$0.55
  • Description:IC FLASH 16MBIT SPI/QUAD 8SOP
  • Series:GD25LQ
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR)

SKU:ea8d8bdd9600 Category: Brand:

  
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GD25LQ16ESEGR is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 16MBIT SPI/QUAD 8SOP. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GD25LQ16ESEGR

  • Description:IC FLASH 16MBIT SPI/QUAD 8SOP
  • Series:GD25LQ
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR)
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NOR (SLC)
  • Memory Size:16Mbit
  • Memory Organization:2M x 8
  • Memory Interface:SPI - Quad I/O, QPI
  • Clock Frequency:133 MHz
  • Write Cycle Time - Word, Page:100µs, 4ms
  • Voltage - Supply:1.65V ~ 2.1V
  • Operating Temperature:-40°C ~ 125°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:8-SOIC (0.209", 5.30mm Width)
  • Supplier Device Package:8-SOP
  • Access Time:6 ns
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for GD25LQ16ESEGR

GD25LQ16ESEGR

Memory IC Overview

The GD25LQ16ESEGR is a non-volatile NOR flash memory integrated circuit manufactured by GigaDevice. It offers a storage capacity of 16 Mbit, organized as 2M x 8 bits. The device utilizes an SPI interface with Quad I/O and QPI support, operating at clock frequencies up to 133 MHz. It functions within a supply voltage range of 1.65V to 2.0V and supports an industrial temperature range from -40°C to +85°C. The component is housed in an 8-SOP surface-mount package.

Memory IC Feature Summary

  • Supports high-speed SPI communication with Quad I/O and QPI modes for efficient data transfer.
  • Features low-voltage operation suitable for portable and battery-powered applications.
  • Provides reliable non-volatile data retention using SLC NAND technology.

Memory IC Applications

  • Embedded systems requiring code execution in place (XIP)
  • Consumer electronics firmware storage
  • Industrial control system data logging

Memory IC Procurement Notes

Verify the specific suffix 'ESEGR' against official manufacturer datasheets to confirm pinout and electrical characteristics. Ensure compatibility with existing PCB footprints and voltage domains before integration. Confirm availability status through authorized distributors as lead times may vary.

Memory IC Selection Notes

Select this component when a 16 Mbit capacity is required with low-voltage operation between 1.65V and 2.0V. It is appropriate for designs needing Quad SPI interfaces and industrial temperature ratings. Compare against similar GD25LQ series variants if different packaging or voltage ranges are preferred.

Memory IC Part Context

This part belongs to the GD25LQ16 family of NOR flash memories designed for cost-effective storage solutions. The family shares common architectural features but varies in package type and voltage specifications. The GD25LQ16ESEGR specifically targets applications requiring robust performance in compact surface-mount configurations.

Memory IC Replacement Considerations

GD25LQ16ESIGR is listed as a substitute option by manufacturers.

GD25LQ16ESEGRGD25LQ16ESEGR
$0.55
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