Memory IC GD25LQ16ETIGR product image

GD25LQ16ETIGR

$0.61
  • Description:IC FLASH 16MBIT SPI/QUAD 8SOP
  • Series:-
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR),Cut Tape (CT)

SKU:0026c5fd2248 Category: Brand:

  
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GD25LQ16ETIGR is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 16MBIT SPI/QUAD 8SOP. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GD25LQ16ETIGR

  • Description:IC FLASH 16MBIT SPI/QUAD 8SOP
  • Series:-
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR),Cut Tape (CT)
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NOR (SLC)
  • Memory Size:16Mbit
  • Memory Organization:2M x 8
  • Memory Interface:SPI - Quad I/O, QPI
  • Clock Frequency:133 MHz
  • Write Cycle Time - Word, Page:60µs, 2.4ms
  • Voltage - Supply:1.65V ~ 2.1V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:8-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package:8-SOP
  • Access Time:6 ns
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for GD25LQ16ETIGR

GD25LQ16ETIGR

Memory IC Overview

The GD25LQ16ETIGR is a 16 Mbit NOR flash memory device manufactured by GigaDevice. It features an SPI interface with support for Quad I/O and QPI modes, operating at a maximum clock frequency of 133 MHz. The storage capacity is organized as 2 M x 8 bits. The component operates within a supply voltage range of 1.65 V to 2.1 V and supports surface mount installation in an 8-SOP package. It is rated for industrial temperature ranges from -40°C to +85°C.

Memory IC Feature Summary

  • Supports standard SPI, Dual I/O, Quad I/O, and QPI interfaces for flexible data transfer options.
  • Provides high-speed sequential read performance up to 133 MHz.
  • Designed for low-voltage operation suitable for portable and battery-powered applications.

Memory IC Applications

  • Code execution from flash (XIP) in embedded systems
  • Storage of firmware and boot code
  • Data storage in consumer electronics

Memory IC Procurement Notes

Verify the specific suffix 'E' against the manufacturer's current datasheet to confirm voltage and speed grades. Ensure the 8-SOP package dimensions match the PCB footprint requirements. Confirm RoHS compliance status through official documentation before finalizing procurement specifications.

Memory IC Selection Notes

Select this part when a 16 Mbit density is required with SPI compatibility. The 1.65 V to 2.1 V voltage range distinguishes it from 2.7 V variants. Consider the 8-SOP package for board space constraints compared to larger packages. Verify that the 133 MHz speed meets system timing requirements.

Memory IC Part Context

This component belongs to the GD25LQ series of NOR flash memories. It shares the 16 Mbit capacity with other variants like GD25LQ16CTIGR but differs in package type and potentially speed or voltage characteristics defined by the suffix letters. It is distinct from the GD25Q series which typically supports higher voltages.

Memory IC Replacement Considerations

GD25LQ16CTIGR offers similar capacity and voltage but uses SOP-8 package and may have different speed ratings. GD25LQ16ESIGR provides Quad I/O support in an SOP-8 package. Verify pinout compatibility and electrical parameters before substitution.

GD25LQ16ETIGRGD25LQ16ETIGR
$0.61
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