Memory IC GD25LQ20CTIGR product image

GD25LQ20CTIGR

  • Description:IC FLASH 2MBIT SPI/QUAD I/O 8SOP
  • Series:-
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR),Cut Tape (CT)

SKU:a15a1245ac47 Category: Brand:

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GD25LQ20CTIGR is listed in the Memory IC range at ChipApex. The manufacturer field lists GigaDevice Semiconductor (HK) Limited. Its product description is IC FLASH 2MBIT SPI/QUAD I/O 8SOP. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GD25LQ20CTIGR

  • Description:IC FLASH 2MBIT SPI/QUAD I/O 8SOP
  • Series:-
  • Mfr:GigaDevice Semiconductor (HK) Limited
  • Package:Tape & Reel (TR),Cut Tape (CT)
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NOR
  • Memory Size:2Mbit
  • Memory Organization:256K x 8
  • Memory Interface:SPI - Quad I/O
  • Clock Frequency:104 MHz
  • Write Cycle Time - Word, Page:50µs, 2.4ms
  • Voltage - Supply:1.65V ~ 2.1V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:8-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package:8-SOP
  • Access Time:-
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for GD25LQ20CTIGR

GD25LQ20CTIGR

Memory IC Overview

The GD25LQ20CTIGR is a 2 Mbit NOR flash memory device manufactured by GigaDevice. It features an SPI interface with a maximum clock frequency of 104 MHz and operates within a supply voltage range of 1.65 V to 2.1 V. The memory organization is 256 k x 8 bits, supporting active read currents up to 25 mA. This component is housed in an SOP-8 package (150 mil) and is designed for industrial temperature applications ranging from -40°C to +85°C.

Memory IC Feature Summary

  • Supports standard SPI communication protocols for data access
  • Operates at low voltage levels suitable for power-constrained systems
  • Industrial-grade thermal stability for extended operational ranges

Memory IC Applications

  • Industrial control systems requiring reliable non-volatile storage
  • Consumer electronics utilizing low-power embedded memory
  • Automotive infotainment and instrumentation modules

Memory IC Procurement Notes

Verify the specific suffix 'C' indicates the commercial/industrial temperature grade and 'TIGR' denotes the tape-and-reel packaging format. Confirm that the 1.8V operating voltage aligns with your system's power rails, as this part differs from the 3.3V GD25Q series. Ensure moisture sensitivity level handling procedures are followed during assembly to prevent package damage.

Memory IC Selection Notes

Select this component when a 2 Mbit capacity is required with a strict 1.8V supply constraint. The SOP-8 package offers a larger footprint compared to USON variants, which may simplify PCB routing. Compare against the GD25LQ20CEIGR if a smaller surface-mount package is preferred while maintaining identical electrical specifications and performance characteristics.

Memory IC Part Context

This part belongs to the GD25LQ20C series, which focuses on low-voltage operations. It shares core architecture with other members like the GD25LQ05CTIGR but provides higher density. The series is distinct from the GD25Q family, which typically supports higher voltages and faster Quad I/O modes.

Memory IC Replacement Considerations

GD25LQ20CEIGR serves as a direct functional substitute with identical electrical parameters, differing only in the USON-8 package form factor.

GD25LQ20CTIGRGD25LQ20CTIGR

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